參數(shù)資料
型號(hào)： ISL1218
廠商： Intersil Corporation
英文描述： Low Power RTC with Battery Backed SRAM(具有電池供電SRAM的低功率RTC)
中文描述： 低功耗RTC與電池供電的SRAM（具有電池供電的SRAM的低功率實(shí)時(shí)時(shí)鐘）
文件頁(yè)數(shù)： 20/21頁(yè)
文件大小： 351K
代理商： ISL1218
20
FN6313.0
June 22, 2006
ISL1218
Mini Small Outline Plastic Packages (MSOP)
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane.
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums
and
to be determined at Datum plane
.
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only.
Interlead flash and
L
0.25
(0.010)
L1
R1
R
4X
θ
4X
θ
GAUGE
PLANE
SEATING
PLANE
E
E1
N
1 2
TOP VIEW
INDEX
AREA
-C-
-B-
0.20 (0.008)
A
B C
SEATING
PLANE
0.20 (0.008)
C
0.10 (0.004)
C
-A-
-H-
SIDE VIEW
b
e
D
A
A1
A2
-B-
END VIEW
0.20 (0.008)
C
D
E
1
C
C
a
- H -
-A -
- B -
- H -
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.010
0.014
0.25
0.36
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
e
0.026 BSC
0.65 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
L1
0.037 REF
0.95 REF
-
N
8
8
7
R
0.003
-
0.07
-
-
R1
0.003
5
o
0
o
-
0.07
5
o
0
o
-
-
0
α
15
o
6
o
15
o
6
o
-
-
Rev. 2 01/03
相關(guān)PDF資料
PDF描述
ISL1219 Low Power RTC with Battery Backed SRAM and Event Detection(具有電池供電的SRAM和事件檢測(cè)功能的低功率RTC)
ISL1220 Low Power RTC with 8 Bytes of Battery Backed SRAM and Separate FOUT(具有電池供電的8位SRAM和獨(dú)立輸出的低功率RTC)
ISL1221 Low Power RTC with Battery Backed SRAM and Event Detection(具有電池供電的SRAM和事件檢測(cè)功能的低功率RTC)
ISL21009 High Voltage Input Precision, Low Noise FGA Voltage References(高電壓輸入精度，低噪聲FGA電壓基準(zhǔn))
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ISL1218IBZ-T 功能描述:實(shí)時(shí)時(shí)鐘 REAL TIME CLKRTC IN 8LD RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
ISL1218IUZ 功能描述:實(shí)時(shí)時(shí)鐘 REAL TIME CLKRTC IN RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
ISL1218IUZ-T 功能描述:實(shí)時(shí)時(shí)鐘 REAL TIME CLKRTC IN RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
ISL1219 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Low Power RTC with Battery Backed SRAM and Event Detection
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