31 FN7576.3 June 7, 2012 Package Outline Drawing M20.3 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC) Rev 3, 2/11 7. The" />
參數(shù)資料
型號(hào): ISL12022MIBZR5421
廠商: Intersil
文件頁(yè)數(shù): 25/31頁(yè)
文件大?。?/td> 0K
描述: IC RTC/CALENDAR TEMP SNSR 20SOIC
應(yīng)用說(shuō)明: Addressing Power Issues in Real Time Clock Appls
產(chǎn)品培訓(xùn)模塊: Solutions for Industrial Control Applications
標(biāo)準(zhǔn)包裝: 760
類(lèi)型: 時(shí)鐘/日歷
特點(diǎn): 警報(bào)器,夏令時(shí),閏年,SRAM
存儲(chǔ)容量: 128B
時(shí)間格式: HH:MM:SS(12/24 小時(shí))
數(shù)據(jù)格式: YY-MM-DD-dd
接口: I²C,2 線串口
電源電壓: 2.7 V ~ 5.5 V
電壓 - 電源,電池: 1.8 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 20-SOIC
包裝: 管件
ISL12022MR5421
31
FN7576.3
June 7, 2012
Package Outline Drawing
M20.3
20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)
Rev 3, 2/11
7. The lead width as measured 0.36mm (0.14 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
DETAIL "X"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
13.00
0.75
0.25
x 45°
0.32
0.23
MAX
1.27
0.40
10.65
10.00
7.60
7.40
20
12
3
INDEX
AREA
2.65
2.35
0.30
MAX
BSC
1.27
0.35
0.49
0.25 (0.10) MC
S
B
M
A
0.10 (0.004)
0.25 (0.10) MB M
1
2
1.27 BSC
(9.40mm)
SEATING PLANE
(0.60)
(2.00)
2
20
3
5
7
NOTES:
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Dimension does not include mold flash, protrusions or gate
3. Dimension does not include interlead lash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
5. Dimension is the length of terminal for soldering to a substrate.
6. Terminal numbers are shown for reference only.
8. Controlling dimension: MILLIMETER.
9. Dimensions in ( ) for reference only.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
(0.024 inch)
10. JEDEC reference drawing number: MS-013-AC.
12.60
相關(guān)PDF資料
PDF描述
ISL12023IVZ IC RTC/CLDR TEMP SNSR 14-TSSOP
ISL12024IRTCZ IC RTC/CALENDER 64BIT 8-TDFN
ISL12024IVZ IC RTC/CALENDAR EEPROM 8-TSSOP
ISL12025IVZ IC RTC/CALENDAR EEPROM 8-TSSOP
ISL12026IBZ-T7A IC RTC/CALENDAR EEPROM 8SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISL12022MIBZ-T 功能描述:實(shí)時(shí)時(shí)鐘 REAL TIME CLK & TEMP COMPENSATED CRYSTAL RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
ISL12022MIBZ-T7A 功能描述:IC RTC/CALENDAR TEMP SNSR 20SOIC RoHS:否 類(lèi)別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 實(shí)時(shí)時(shí)鐘 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類(lèi)型:時(shí)鐘/日歷 特點(diǎn):警報(bào)器,閏年,SRAM 存儲(chǔ)容量:- 時(shí)間格式:HH:MM:SS(12/24 小時(shí)) 數(shù)據(jù)格式:YY-MM-DD-dd 接口:SPI 電源電壓:2 V ~ 5.5 V 電壓 - 電源,電池:- 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:8-WDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:8-TDFN EP 包裝:管件
ISL12022MIBZ-TR5421 功能描述:實(shí)時(shí)時(shí)鐘 REAL TIME CLK W/MFK IMPROVED ESD AIR RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
ISL12022MR5421 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:Low Power RTC with Battery Backed SRAM, Integrated 5ppm
ISL12022M-R5421 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:High-Accuracy RTC Modules, Feature-Rich RTCs