參數(shù)資料
型號(hào): ISD2340
廠商: WINBOND ELECTRONICS CORP
英文描述: SINGLE-CHIP, MULTIPLE-MESSAGES, VOICE RECORD/PLAYBACK DEVICE 32-, 40-, 48-, AND 64-SECOND DURATION
中文描述: 單芯片,多消息,語音記錄/播放設(shè)備32 - ,40 - ,48 - ,和64秒時(shí)間間隔
文件頁數(shù): 4/42頁
文件大?。?/td> 1356K
代理商: ISD2340
ISD2532/40/48/64
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM .............................................................................................................................. 3
4. TABLE OF CONTENTS...................................................................................................................... 4
5. PIN CONFIGURATION....................................................................................................................... 5
6. PIN DESCRIPTION............................................................................................................................. 6
7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10
7.1. Detailed Description.................................................................................................................... 10
7.2. Operational Modes ..................................................................................................................... 11
7.2.1. Operational Modes Description............................................................................................ 12
8. TIMING DIAGRAMS.......................................................................................................................... 16
9. ABSOLUTE MAXIMUM RATINGS....................................................................................................19
9.1 Operating Conditions................................................................................................................... 20
10. ELECTRICAL CHARACTERISTICS............................................................................................... 21
10.1. Parameters For Packaged Parts.............................................................................................. 21
10.1.1. Typical Parameter Variation with Voltage and Temperature - Packaged Parts................ 24
10.2. Parameters For Die .................................................................................................................. 25
10.2.1. Typical Parameter Variation with Voltage and Temperature - Die .................................... 28
10.3. Parameters For Push-Button Mode..........................................................................................29
11. TYPICAL APPLICATION CIRCUIT................................................................................................. 30
12. PACKAGE DRAWING AND DIMENSIONS.................................................................................... 35
12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 35
12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP)............................................................... 36
12.3. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1................................ 37
12.4. Die Bonding Physical Layout
[1]
................................................................................................ 38
14. VERSION HISTORY ....................................................................................................................... 41
- 4 -
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ISD2540E SINGLE-CHIP, MULTIPLE-MESSAGES, VOICE RECORD/PLAYBACK DEVICE 32-, 40-, 48-, AND 64-SECOND DURATION
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