參數(shù)資料
型號(hào)： ISD17210XYI
廠商： WINBOND ELECTRONICS CORP
英文描述： R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 48K; RAM: 2.5K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 62.5 (@16MHz); Operating Frequency / Supply Voltage: 16MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 125; Package Code: PLQP0048KB-A (48P6Q-A)
中文描述： 多信息單芯片語(yǔ)音記錄
文件頁(yè)數(shù)： 6/24頁(yè)
文件大小： 365K
代理商： ISD17210XYI
ISD1700 SERIES
- 6 -
4 PINOUT CONFIGURATION
Refer to Design Guide for details before performing any design or PCB layout.
TSOP
ISD1700
V
SSA
AnaIn
MIC-
V
SSP2
MIC+
SP-
V
CCP
Sp+
V
CCA
V
SSP1
AUD/AUX
AGC
VOL
R
OSC
V
CCD
V
SSD
MOSI
MISO
RESET
SCLK
INT / RDY
FWD
REC
PLAY
LED
SS
FT
ERASE
SOIC / PDIP
ISD1700
V
CCD
PLAY
RESET
INT / RDY
FWD
V
SSA
FT
LED
MIC-
MIC+
V
CCA
SP-
ERASE
REC
MOSI
SS
SCLK
MISO
AnaIn
V
SSP2
V
CCP
V
SSP1
Sp+
AUD / AUX
AGC
VOL
R
OSC
V
SSD
相關(guān)PDF資料
PDF描述
ISD17210XYI01 R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
ISD17210XYIR R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
ISD1750A Multi-Message Single-Chip Voice Record&Playback Devices
ISD1700A Multi-Message Single-Chip Voice Record&Playback Devices
ISD1740A RES 2K00 SM 1/8W F 0805C THKF 100PPM TR
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD17210XYI01 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYIR 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYIR01 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYR 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYR01 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
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