參數(shù)資料
型號(hào): ISD17210XYI
廠商: WINBOND ELECTRONICS CORP
英文描述: R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 48K; RAM: 2.5K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 62.5 (@16MHz); Operating Frequency / Supply Voltage: 16MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 125; Package Code: PLQP0048KB-A (48P6Q-A)
中文描述: 多信息單芯片語(yǔ)音記錄
文件頁(yè)數(shù): 20/24頁(yè)
文件大小: 365K
代理商: ISD17210XYI
ISD1700 SERIES
- 20 -
11.2 28-L
EAD
300-M
IL
P
LASTIC
S
MALL
O
UTLINE
I
NTEGRATED
C
IRCUIT
(SOIC)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
1
2
3 4
5
6
7
8 9 10 11 12 13 14
A
D
E
F
B
G
C
H
Min
0.701
0.097
0.292
0.005
0.014
Nom
0.706
0.101
0.296
0.009
0.016
0.050
0.406
0.032
Max
0.711
0.104
0.299
0.0115
0.019
Min
17.81
2.46
7.42
0.127
0.35
Nom
17.93
2.56
7.52
0.22
0.41
1.27
10.31
0.81
Max
18.06
2.64
7.59
0.29
0.48
A
B
C
D
E
F
G
H
0.400
0.024
0.410
0.040
10.16
0.61
10.41
1.02
Note:
Lead coplanarity to be within 0.004 inches.
Plastic Small Outline Integrated Circuit (SOIC) Dimensions
INCHES
MILLIMETERS
相關(guān)PDF資料
PDF描述
ISD17210XYI01 R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
ISD17210XYIR R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
ISD1750A Multi-Message Single-Chip Voice Record&Playback Devices
ISD1700A Multi-Message Single-Chip Voice Record&Playback Devices
ISD1740A RES 2K00 SM 1/8W F 0805C THKF 100PPM TR
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD17210XYI01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYIR 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYIR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYR 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices