型號(hào): | ISD17210XYI01 |
廠商: | WINBOND ELECTRONICS CORP |
英文描述: | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
中文描述: | 多信息單芯片語(yǔ)音記錄 |
文件頁(yè)數(shù): | 22/24頁(yè) |
文件大?。?/td> | 365K |
代理商: | ISD17210XYI01 |
相關(guān)PDF資料 |
PDF描述 |
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ISD17210XYIR | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
ISD1750A | Multi-Message Single-Chip Voice Record&Playback Devices |
ISD1700A | Multi-Message Single-Chip Voice Record&Playback Devices |
ISD1740A | RES 2K00 SM 1/8W F 0805C THKF 100PPM TR |
ISD1760A | Multi-Message Single-Chip Voice Record&Playback Devices |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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ISD17210XYIR | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
ISD17210XYIR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
ISD17210XYR | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
ISD17210XYR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
ISD17240 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |