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參數(shù)資料
| 型號： | ISD17210XYI01 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 英文描述： | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
| 中文描述： | 多信息單芯片語音記錄 |
| 文件頁數(shù)： | 21/24頁 |
| 文件大小： | 365K |
| 代理商： | ISD17210XYI01 |
ISD1700 SERIES
Publication Release Date: January 23, 2007
- 21 -
Revision 1.3-S2
11.3 28-L
EAD
600-M
IL
P
LASTIC
D
UAL
I
NLINE
P
ACKAGE
(PDIP)
Plastic Dual Inline Package (PDIP) (P) Dimensions
INCHES
Min
Nom
Max
1.445
1.450
1.455
0.150
0.065
0.070
0.075
0.600
0.625
0.530
0.540
0.550
0.015
0.125
0.135
0.015
0.018
0.022
0.055
0.060
0.065
0.100
0.008
0.010
0.012
0.070
0.075
0.080
0°
MILLIMETERS
Nom
36.83
3.81
1.78
13.72
0.46
1.52
2.54
0.25
1.91
Min
36.70
1.65
15.24
13.46
0.38
3.18
0.38
1.40
0.20
1.78
0°
Max
36.96
1.91
15.88
13.97
4.83
3.43
0.56
1.65
0.30
2.03
15°
A
B1
B2
C1
C2
D
D1
E
F
G
H
J
S
0
0.19
15°
11.4 D
IE
I
NFORMATION
For die info, please contact the local Winbond Sales Representatives.
相關PDF資料 |
PDF描述 |
|---|---|
| ISD17210XYIR | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
| ISD1750A | Multi-Message Single-Chip Voice Record&Playback Devices |
| ISD1700A | Multi-Message Single-Chip Voice Record&Playback Devices |
| ISD1740A | RES 2K00 SM 1/8W F 0805C THKF 100PPM TR |
| ISD1760A | Multi-Message Single-Chip Voice Record&Playback Devices |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| ISD17210XYIR | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XYIR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XYR | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XYR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17240 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
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