參數(shù)資料
型號: ISD17210PYI01
廠商: WINBOND ELECTRONICS CORP
英文描述: Multi-Message Single-Chip Voice Record & Playback Devices
中文描述: 多信息單芯片語音記錄
文件頁數(shù): 20/24頁
文件大?。?/td> 365K
代理商: ISD17210PYI01
ISD1700 SERIES
- 20 -
11.2 28-L
EAD
300-M
IL
P
LASTIC
S
MALL
O
UTLINE
I
NTEGRATED
C
IRCUIT
(SOIC)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
1
2
3 4
5
6
7
8 9 10 11 12 13 14
A
D
E
F
B
G
C
H
Min
0.701
0.097
0.292
0.005
0.014
Nom
0.706
0.101
0.296
0.009
0.016
0.050
0.406
0.032
Max
0.711
0.104
0.299
0.0115
0.019
Min
17.81
2.46
7.42
0.127
0.35
Nom
17.93
2.56
7.52
0.22
0.41
1.27
10.31
0.81
Max
18.06
2.64
7.59
0.29
0.48
A
B
C
D
E
F
G
H
0.400
0.024
0.410
0.040
10.16
0.61
10.41
1.02
Note:
Lead coplanarity to be within 0.004 inches.
Plastic Small Outline Integrated Circuit (SOIC) Dimensions
INCHES
MILLIMETERS
相關(guān)PDF資料
PDF描述
ISD17210PYIR Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYIR01 Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYR Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYR01 Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SY Multi-Message Single-Chip Voice Record & Playback Devices
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD17210PYIR 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYIR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYR 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SY 功能描述:IC VOICE REC/PLAY 210SEC 28-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 語音錄制和重放 系列:ISD1700, ChipCorder® 標準包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP(0.300",7.62mm) 供應商設備封裝:28-PDIP 其它名稱:90-21300+000