參數(shù)資料
型號(hào): ISD17210PYI01
廠商: WINBOND ELECTRONICS CORP
英文描述: Multi-Message Single-Chip Voice Record & Playback Devices
中文描述: 多信息單芯片語音記錄
文件頁(yè)數(shù): 12/24頁(yè)
文件大?。?/td> 365K
代理商: ISD17210PYI01
ISD1700 SERIES
- 12 -
7.2 SPI
O
PERATION
T
SSH
T
SSmin
T
SCKhi
T
SSS
T
DIS
T
DIH
T
SCKlow
T
DF
(TRISTATE)
SS
SCLK
MOSI
MISO
LSB
T
PD
MSB
LSB
MSB
Figure 12.8: SPI Operation
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
SS
Setup Time
T
SSS
500
nsec
SS
Hold Time
T
SSH
500
nsec
Data in Setup Time
T
DIS
200
nsec
Data in Hold Time
T
DIH
200
nsec
Output Delay
T
PD
500
nsec
Output Delay to HighZ
T
DF
500
nsec
SS
HIGH
T
SSmin
1
μsec
SCLK High Time
T
SCKhi
400
nsec
SCLK Low Time
T
SCKlow
400
nsec
CLK Frequency
F
0
1,000
KHz
Power-Up Delay
[1]
Notes:
[1]
The value shown is based upon 8 kHz sampling frequency. Delay increases proportionally for
slower sampling frequency.
T
PUD
50
msec
相關(guān)PDF資料
PDF描述
ISD17210PYIR Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYIR01 Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYR Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYR01 Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SY Multi-Message Single-Chip Voice Record & Playback Devices
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD17210PYIR 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYIR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYR 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SY 功能描述:IC VOICE REC/PLAY 210SEC 28-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 語音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000