參數(shù)資料
型號(hào): IRF7706
廠商: International Rectifier
英文描述: Power MOSFET(Vdss=-30V)
中文描述: 功率MOSFET(30V的減振鋼板基本\u003d-)
文件頁(yè)數(shù): 1/8頁(yè)
文件大?。?/td> 152K
代理商: IRF7706
HEXFET
Power MOSFET
10/04/00
IRF7706
Absolute Maximum Ratings
www.irf.com
1
Thermal Resistance
Parameter
Max.
-30
-7.0
-5.7
-28
1.51
0.96
Units
V
V
DS
I
D
@ T
A
= 25°C
I
D
@ T
A
= 70°C
I
DM
P
D
@T
A
= 25°C
P
D
@T
A
= 70°C
Linear Derating Factor 0.01 W/°C
V
GS
Gate-to-Source Voltage
± 20 V
T
J
, T
STG
Junction and Storage Temperature Range
Drain-Source Voltage
Continuous Drain Current, V
GS
@ -10V
Continuous Drain Current, V
GS
@ -10V
Pulsed Drain Current
Maximum Power Dissipation
Maximum Power Dissipation
A
W
W
-55 to + 150
°C
PD -94003
V
DSS
-30V
R
DS(on)
max
22m
@V
GS
= -10V
36m
@V
GS
= -4.5V
I
D
-
7.0A
-5.6A
Parameter
Max.
83
Units
°C/W
R
θ
JA
Maximum Junction-to-Ambient
TSSOP-8
4 = G
3 = S
2 = S
1 = D
1
2
3
4
G
D
S
5
6
7
8
8 = D
7 = S
6 = S
5 = D
Description
HEXFET
Power MOSFETs from International Rectifier
utilize advanced processing techniques to achieve ex-
tremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design, that Inter-
national Rectifier is well known for,
provides the de-
signer with an extremely efficient and reliable device
for battery and load management.
l
Ultra Low On-Resistance
l
P-Channel MOSFET
l
Very Small SOIC Package
l
Low Profile (< 1.2mm)
l
Available in Tape & Reel
The TSSOP-8 package has 45% less footprint area than
the standard SO-8. This makes the TSSOP-8 an ideal
device for applications where printed circuit board space
is at a premium. The low profile (<1.2mm) allows it to fit
easily into extremely thin environments such as portable
electronics and PCMCIA cards.
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