IDT72V36100/72V36110 3.3V HIGH DENSITY SUPERSYNC IITM <" />
參數(shù)資料
型號(hào): IDT72V36110L7-5BBI
廠商: IDT, Integrated Device Technology Inc
文件頁(yè)數(shù): 22/48頁(yè)
文件大?。?/td> 0K
描述: IC FIFO 131KX36 7-5NS 144BGA
標(biāo)準(zhǔn)包裝: 1
系列: 72V
功能: 同步
存儲(chǔ)容量: 4.7M(131K x 36)
數(shù)據(jù)速率: 166MHz
訪問(wèn)時(shí)間: 5ns
電源電壓: 3.15 V ~ 3.45 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 144-BGA
供應(yīng)商設(shè)備封裝: 144-PBGA(13x13)
包裝: 托盤(pán)
其它名稱: 72V36110L7-5BBI
800-2341
IDT72V36110L7-5BBI-ND
29
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V36100/72V36110 3.3V HIGH DENSITY SUPERSYNC IITM 36-BIT FIFO
65,536 x 36 and 131,072 x 36
OCTOBER 22, 2008
Figure
9.
Write
Timing
(First
Word
Fall
Through
Mode)
NOTES:
1.
tSKEW1
is
the
minimum
time
between
a
rising
WCLK
edge
and
a
rising
RCLK
edge
to
guarantee
that
OR
will
go
LOW
after
two
RCLK
cycles
plus
t
REF
.If
the
time
between
the
rising
edge
of
WCLK
and
the
rising
edge
of
RCLK
is
less
than
tSKEW1
,then
OR
assertion
may
be
delayed
one
extra
RCLK
cycle.
2.
tSKEW2
is
the
minimum
time
between
a
rising
WCLK
edge
and
a
rising
RCLK
edge
to
guarantee
that
PAE
will
go
HIGH
after
one
RCLK
cycle
plus
t
PAES
.If
the
time
between
the
rising
edge
of
WCLK
and
the
rising
edge
of
RCLK
is
less
than
tSKEW2
,then
the
PAE
deassertion
may
be
delayed
one
extra
RCLK
cycle.
3.
LD
=
HIGH,
OE
=
LOW
4.
n=
PAE
offset,
m
=
PAF
offset
and
D
=
maximum
FIFO
depth.
5.
D
=
65,537
for
the
IDT72V36100
and
131,073
for
the
IDT72V36110.
6
.
First
data
word
latency
=
t
SKEW1
+
2*T
RCLK
+
t
REF.
W
1
W
2
W
4
W
[n
+2]
W
[D-m-1]
W
[D-m-2]
W
[D
-1]
W
D
W
[n+3]
W
[n+4]
W
[D-m]
W
[D-m+1]
WCLK
WEN
D
0
-
D
17
RCLK
tDH
tDS
tSKEW1
(1)
REN
Q
0
-
Q
17
PAF
HF
PAE
IR
tDS
tSKEW2
tA
tREF
OR
tPAES
tHF
tPAFS
tWFF
W
[D-m+2]
W
1
tENH
6117
drw14
DATA
IN
OUTPUT
REGISTER
(2)
W
3
1
2
3
1
D-1
2
+1
]
[
W
D-1
+2
]
[
W
2
D-1
+3
]
[
W
2
1
2
tENS
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IDT72V36110L7-5PF 功能描述:IC FIFO 131KX36 7-5NS 128QFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256(64 x 4) 數(shù)據(jù)速率:- 訪問(wèn)時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433
IDT72V36110L7-5PF8 功能描述:IC FIFO 131KX36 7-5NS 128QFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256(64 x 4) 數(shù)據(jù)速率:- 訪問(wèn)時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433
IDT72V36110L7-5PFGI 功能描述:3.3V SUPERSYNC II 36BIT FIFO RoHS:是 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:90 系列:74ABT 功能:同步,雙端口 存儲(chǔ)容量:4.6K(64 x 36 x2) 數(shù)據(jù)速率:67MHz 訪問(wèn)時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:120-LQFP 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:120-HLQFP(14x14) 包裝:托盤(pán) 產(chǎn)品目錄頁(yè)面:1005 (CN2011-ZH PDF) 其它名稱:296-3984
IDT72V36110L7-5PFI 功能描述:IC FIFO 131KX36 7-5NS 128QFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256(64 x 4) 數(shù)據(jù)速率:- 訪問(wèn)時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433
IDT72V3611L12PQF 制造商:Integrated Device Technology Inc 功能描述:72V3611L12PQF