IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC IITM NARROW BUS FIFO
參數(shù)資料
型號(hào): IDT72V2113L6BC
廠商: IDT, Integrated Device Technology Inc
文件頁(yè)數(shù): 37/46頁(yè)
文件大?。?/td> 0K
描述: IC FIFO SUPERSYNCII 6NS 100-BGA
標(biāo)準(zhǔn)包裝: 1
系列: 72V
功能: 同步
存儲(chǔ)容量: 4.7Mb(262k x 18)
訪問(wèn)時(shí)間: 4ns
電源電壓: 3.15 V ~ 3.45 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 100-LBGA
供應(yīng)商設(shè)備封裝: 100-CABGA(11x11)
包裝: 托盤(pán)
其它名稱: 72V2113L6BC
42
IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC IITM NARROW BUS FIFO
8K x 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC IITM NARROW BUS FIFO
131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9
JUNE 1, 2010
JTAG INTERFACE
Five additional pins (TDI, TDO, TMS, TCK and
TRST) are provided to
support the JTAG boundary scan interface. The IDT72V2103/72V2113
incorporates the necessary tap controller and modified pad cells to implement
the JTAG facility.
Note that IDT provides appropriate Boundary Scan Description Language
program files for these devices.
The Standard JTAG interface consists of four basic elements:
Test Access Port (TAP)
TAP controller
Instruction Register (IR)
Data Register Port (DR)
The following sections provide a brief description of each element. For a
completedescriptionrefertotheIEEEStandardTestAccessPortSpecification
(IEEE Std. 1149.1-1990).
The Figure below shows the standard Boundary-Scan Architecture
Figure 32. Boundary Scan Architecture
TEST ACCESS PORT (TAP)
The Tap interface is a general-purpose port that provides access to the
internaloftheprocessor. Itconsistsoffourinputports(TCLK,TMS,TDI,
TRST)
and one output port (TDO).
THE TAP CONTROLLER
The Tap controller is a synchronous finite state machine that responds to
TMS and TCLK signals to generate clock and control signals to the Instruction
and Data Registers for capture and update of data.
T
A
P
TAP
Cont-
roller
Mux
DeviceID Reg.
Boundary Scan Reg.
Bypass Reg.
clkDR, ShiftDR
UpdateDR
TDO
TDI
TMS
TCLK
TRST
clklR, ShiftlR
UpdatelR
Instruction Register
Instruction Decode
Control Signals
6119 drw35
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IDT72V2113L6PF 功能描述:IC FIFO SUPERSYNCII 6NS 80-TQFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256(64 x 4) 數(shù)據(jù)速率:- 訪問(wèn)時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433
IDT72V2113L6PF8 功能描述:IC FIFO SUPERSYNCII 6NS 80-TQFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256(64 x 4) 數(shù)據(jù)速率:- 訪問(wèn)時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433
IDT72V2113L6PFG 功能描述:IC FIFO SUPERSYNCII 6NS 80TQFP RoHS:是 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:90 系列:74ABT 功能:同步,雙端口 存儲(chǔ)容量:4.6K(64 x 36 x2) 數(shù)據(jù)速率:67MHz 訪問(wèn)時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:120-LQFP 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:120-HLQFP(14x14) 包裝:托盤(pán) 產(chǎn)品目錄頁(yè)面:1005 (CN2011-ZH PDF) 其它名稱:296-3984
IDT72V2113L7-5BC 功能描述:IC FIFO SUPERSYNCII 7-5NS 100BGA RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:90 系列:74ABT 功能:同步,雙端口 存儲(chǔ)容量:4.6K(64 x 36 x2) 數(shù)據(jù)速率:67MHz 訪問(wèn)時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:120-LQFP 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:120-HLQFP(14x14) 包裝:托盤(pán) 產(chǎn)品目錄頁(yè)面:1005 (CN2011-ZH PDF) 其它名稱:296-3984
IDT72V2113L7-5BCGI 制造商:Integrated Device Technology Inc 功能描述:IC FIFO SYNC 3.3V 5NS 100-LBGA