參數(shù)資料
型號(hào): ICS8538BG-31LF
廠商: IDT, Integrated Device Technology Inc
文件頁(yè)數(shù): 14/14頁(yè)
文件大?。?/td> 0K
描述: IC CLOCK BUFFER MUX 2:8 28-TSSOP
標(biāo)準(zhǔn)包裝: 50
系列: HiPerClockS™
類(lèi)型: 扇出緩沖器(分配),多路復(fù)用器
電路數(shù): 1
比率 - 輸入:輸出: 2:8
差分 - 輸入:輸出: 無(wú)/是
輸入: LVCMOS,LVTTL,晶體
輸出: LVPECL
頻率 - 最大: 266MHz
電源電壓: 3.135 V ~ 3.465 V
工作溫度: 0°C ~ 70°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 28-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 28-TSSOP
包裝: 管件
其它名稱: 8538BG-31LF
ICS8538-31
LOW SKEW, 1-TO-8, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
IDT / ICS LVPECL FANOUT BUFFER
9
ICS8538BG-31 REV. B FEBRUARY 5, 2008
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8538-31.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS8538-31 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 110mA = 381.15mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 8 * 30mW = 240mW
Total Power_MAX (3.3V, with all outputs switching) = 381.15mW + 240mW = 621.15mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow
and a multi-layer board, the appropriate value is 49.8°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.621W * 49.8°C/W = 100.9°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (single layer or multi-layer).
Table 7. Thermal Resistance θJA for 28 Lead TSSOP, Forced Convection
NOTE: Most modern PCB design use multi-layered boards. The data in the second row pertains to most designs.
θ
JA by Velocity
Linear Feet per Minute
0200
500
Single-Layer PCB, JEDEC Standard Test Boards
82.9°C/W
68.7°C/W
60.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
49.8°C/W
43.9°C/W
41.2°C/W
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