參數資料
型號: ICS85352AYILFT
廠商: IDT, Integrated Device Technology Inc
文件頁數: 6/20頁
文件大小: 0K
描述: IC CLOCK MUX 2:12 700MHZ 48-TQFP
標準包裝: 1,000
系列: HiPerClockS™
類型: 多路復用器
電路數: 1
比率 - 輸入:輸出: 2:12
差分 - 輸入:輸出: 是/是
輸入: HCSL,LVDS,LVHSTL,LVPECL,SSTL
輸出: LVPECL
頻率 - 最大: 700MHz
電源電壓: 3.135 V ~ 3.465 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 48-TQFP 裸露焊盤
供應商設備封裝: 48-PTQFP-EP(7x7)
包裝: 帶卷 (TR)
其它名稱: 85352AYILFT
ICS85352AYI REVISION C AUGUST 3, 2010
14
2010 Integrated Device Technology, Inc.
ICS85352I Data Sheet
12 BIT, 2-TO-1, 3.3V, 2.5V LVPECL CLOCK BUFFER
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS85352I.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS85352I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 170mA = 589.05mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 12 * 30mW = 360mW
Total Power_MAX (3.3V, with all outputs switching) = 589.05mW + 360mW = 949.05mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and it directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a moderate air
flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 22.6°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.949W * 22.6°C/W = 106.4°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 6. Thermal Resistance θJA for 48 Lead TQFP, Forced Convection
θ
JA by Velocity
Linear Feet per Minute
0
200
500
Multi-Layer PCB, JEDEC Standard Test Boards
27.6°C/W
22.6°C/W
20.78°C/W
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