- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄2073 > ICS85108AGILFT (IDT, Integrated Device Technology Inc)IC CLK BUFFER 1:8 500MHZ 24TSSOP PDF資料下載
參數(shù)資料
| 型號(hào)： | ICS85108AGILFT |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁數(shù)： | 3/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC CLK BUFFER 1:8 500MHZ 24TSSOP |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 系列： | HiPerClockS™ |
| 類型： | 扇出緩沖器（分配） |
| 電路數(shù)： | 1 |
| 比率 - 輸入:輸出： | 1:8 |
| 差分 - 輸入:輸出： | 是/是 |
| 輸入： | HCSL，LVDS，LVHSTL，LVPECL，SSTL |
| 輸出： | HCSL |
| 頻率 - 最大： | 500MHz |
| 電源電壓： | 2.97 V ~ 3.63 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-TSSOP |
| 包裝： | 帶卷 (TR) |
ICS85108I Data Sheet
LOW SKEW, 1-TO-8, DIFFERENTIAL-TO-0.7V HCSL CLOCK DISTRIBUTION CHIP
ICS85108AGI REVISION A OCTOBER 23, 2009
11
2009 Integrated Device Technology, Inc.
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS85108I.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS85108I is the sum of the core power plus the analog power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 10% = 3.63V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VDD_MAX *IDD_MAX = 3.63V * 27mA = 98.01mW
Power (outputs)MAX = 47.3mW/Loaded Output Pair
If all outputs are loaded, the total power is 8 * 47.3mW = 378.4mW
Total Power_MAX = (3.465V, with all outputs switching) = 98.01mW + 378.4mW = 476.41mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature for HiPerClockS devices is 125°C. Limiting the internal transistor junction temperature, Tj, to
125°C ensures that the bond wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming 1 meter per
second and a multi-layer board, the appropriate value is 83.5°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.476W * 83.5°C/W = 124.7°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 6. Thermal Resistance θJA for 24 Lead TSSOP, Forced Convection
θ
JA Vs. Air Flow
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
87.8°C/W
83.5°C/W
81.3°C/W
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ICS8516FYILFT | IC CLK BUFF 1:16 700MHZ 48-LQFP |
| ICS8516FYLFT | IC CLK BUFF 1:16 700MHZ 48-LQFP |
| ICS8520DYLF | IC CLK BUFF 1:16 500MHZ 48-LQFP |
| ICS85210AY-31LF | IC CLK BUFFER 1:5 650MHZ 32-LQFP |
| ICS85211AMI-01LF | IC CLK BUFFER 1:2 700MHZ 8-SOIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ICS85108AGIT | 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFFER 1:8 500MHZ 24TSSOP |
| ICS8512061AGILF | 功能描述:IC TXRX BIDIR 0.7V 1CH 8-TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:250 系列:- 類型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:3 V ~ 5.5 V 安裝類型:表面貼裝 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:帶卷 (TR) |
| ICS8512061AGILFT | 功能描述:IC TXRX BIDIR 0.7V 1CH 8-TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:250 系列:- 類型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:3 V ~ 5.5 V 安裝類型:表面貼裝 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:帶卷 (TR) |
| ICS8516FY | 制造商:Integrated Device Technology Inc 功能描述:IC FANOUT BUFFER LVDS 48LQFP 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFFER 1:16 700MHZ 48LQFP |
| ICS8516FYI | 制造商:Integrated Device Technology Inc 功能描述:IC FANOUT BUFFER LVDS 48LQFP 制造商:Integrated Device Technology Inc 功能描述:IC CLK BUFFER 1:16 700MHZ 48LQFP |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。