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參數(shù)資料
| 型號： | HYMP112S64LMP8-E3 |
| 廠商： | Hynix Semiconductor Inc. |
| 英文描述： | BNC FEMALE TO RCA MALE COUPLER |
| 中文描述： | DDR2 SDRAM的SO - DIMM插槽 |
| 文件頁數(shù)： | 17/17頁 |
| 文件大小： | 405K |
| 代理商： | HYMP112S64LMP8-E3 |
HYMP112S64(L)MP8
Rev. 0.1/ July 2004
17
- continued -
Note :
1. The bank address is excluded
2. This value is based on the component specification
3. These bytes are programmed by code of date week & date year
4. These bytes apply to Hynix’s own Module Serial Number System
5. These bytes undefined and coded as ‘00h’
6. Refer to Hynix Web Site
Byte 83~84, Low Power Part
Byte#
Function Description
Speed
Grade
Function
Supported
Hexa
Value
Note
42
Minimum auto-refresh to active/auto-refresh
command period(tRFC)
Maximum cycle time (tCK max)
all
105ns
69
43
all
8.0ns
0.35ns
0.30ns
0.45ns
0.40ns
No PLL
Undefined
1.0
-
-
-
-
Hynix JEDEC ID
-
Hynix(Korea Area)
HSA(United States Area)
HSE(Europe Area)
HSJ(Japan Area)
Singapore
Asia Area
H
Y
M
P
1
1
2
S
6
4
M
P
8
‘-’
E
C
3
4
5
Blank
80
23
1E
2D
28
00
00
10
C5
4C
3F
23
AD
00
0*
1*
2*
3*
4*
5*
48
59
4D
50
31
31
32
53
36
34
4D
50
38
2D
45
43
33
34
35
20
44
Maximim DQS-DQ skew time(tDQSQ)
E3, E4
C4, C5
E3, E4
C4, C5
45
Maximum read data hold skew factor(tQHS)
46
PLL Relock time
Superset information(may be used in future)
SPD Revision code
47~61
62
63
Checksum for Bytes 0~62
E3
E4
C4
C5
64
Manufacturer JEDEC ID Code
--------- Manufacturer JEDEC ID Code
65~71
72
Manufacturing location
6
73
74
75
76
77
78
79
80
81
82
83
84
85
86
Manufacture part number(Hynix Memory Module)
-------- Manufacture part number(Hynix Memory Module)
-------- Manufacture part number(Hynix Memory Module)
Manufacture part number (DDR2 SDRAM)
---------Manufacture part number(Memory density)
Manufacture part number(Module Depth)
------- Manufacture part number(Module Depth)
Manufacture part number(Module type)
Manufacture part number(Data width)
-------Manufacture part number(Data width)
Manufacture part number(Package type)
Manufacture part number(Package material)
Manufacture part number(Component configuration)
Manufacture part number(Hyphen)
87
Manufacture part number(Minimum cycle time)
E3, E4
C4, C5
E3
E4,C4
C5
88
-------Manufacture part number(Minimum cycle time)
89~90
91
92
93
94
95~98
99~127 Manufacturer specific data (may be used in future)
128~255 Open for customer use
Manufacture part number(T.B.D)
Manufacture revision code(for Component)
Manufacture revision code (for PCB)
Manufacturing date(Year)
Manufacturing date(Week)
Module serial number
3
3
4
5
5
Undefined
Undefined
00
00
Byte #
Function Description
Speed
Grade
Function Supported
Hexa
Value
4C
4D
Note
83
84
Manufacture part number(Low power part)
Manufacture part number(Package type)
L
M
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HYMP112S64LMP8-E4 | DDR2 SDRAM SO-DIMM |
| HYMP112S64MP8 | SHIELDED, RJ45 TO DB25 ADP, P |
| HYMP112S64MP8-C4 | SCREW LOCKS MALE |
| HYMP112S64MP8-C5 | SCREW LOCKS MALE |
| HYMP112S64MP8-E3 | SCREW LOCKS MALE |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HYMP112S64LMP8-E4 | 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:DDR2 SDRAM SO-DIMM |
| HYMP112S64M8-C4 | 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:200pin Unbuffered DDR2 SDRAM SO-DIMMs based on 512 Mb 1st ver. |
| HYMP112S64M8-E3 | 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:200pin Unbuffered DDR2 SDRAM SO-DIMMs based on 512 Mb 1st ver. |
| HYMP112S64MP8 | 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:DDR2 SDRAM SO-DIMM |
| HYMP112S64MP8-C4 | 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:200pin Unbuffered DDR2 SDRAM SO-DIMMs based on 512 Mb 1st ver. |
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