Pad Description
Pad No.
Pad Name
I/O Mask Option
F unction
17, 18
BZ,BZ
O
Note 1
Sound effect outputs
8
9
TE ST1
TE ST2
I
I
—
For test mode only
T E ST 1 and TE ST 2 are left open when the
HTG1390 is in normal operation (with an internal
pull high resistor).
5~7
COM2~COM0
O
Note 2
Output for LCD panel common plate
10~13
PS3~PS0
I
Pull-high or
None. Note 3
4-bit port for input only
16
VSS
I
—
Negative power supply, GND
15
14
OSCI
OSCO
I
O
—
OSCI,OSCO are connected to an external resistor
for an internal system clock
19~21
PA2~PA0
O
CMOS or
NMOS Open
Drain
3-bit latch port for output only
22~24
PP0~PP2
I
Pull-high or
None. Note 2
3-bit port for input only
25
RE S
I
—
Input to reset an internal LSI
Reset is active on logical low level
26~52
SE G0~SE G26
O
—
LCD driver outputs for LCD panel segment
1
VDD
I
—
Positive power supply
4
V3
I
—
LCD system power 1/2 bias generated
2, 3
C1, C2
I
—
LCD system voltage booster condensor connecting
terminal
Notes: The system clock provides 6 different sources selectable by mask option to drive the sound
effect clock. If the Holtek sound library is used only 128K and 64K are acceptable.
E ach bit of ports PS and PP can be a trigger source of the HALT interrupt, selectable by mask
option.
Absolute Maximum Ratings*
Supply Voltage.................................–0.3V~5.5V
Input Voltage.....................V
SS
–0.3V~V
DD
+0.3V
Operating Temperature......................0°C~70°C
Storage Temperature....................–50°C~125°C
*Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute Maxi-
mum Ratings” may cause substantial damage to the device. Functional operation of this
device at other conditions beyond those listed in the specification is not implied and prolonged
exposure to extreme conditions may affect device reliability.
HTG1390
Preliminary
5
17th Nov ’98