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參數(shù)資料
| 型號： | HTCS138MS |
| 廠商： | Intersil Corporation |
| 英文描述： | Radiation Hardened Inverting 3-to-8 Line Decoder/Demultiplexer |
| 中文描述： | 輻射加固反相3至8線路解碼器/解復(fù)用器 |
| 文件頁數(shù)： | 9/9頁 |
| 文件大小： | 308K |
| 代理商： | HTCS138MS |
9
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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FN2462.3
September 12, 2005
HCTS138MS
Die Characteristics
DIE DIMENSIONS:
85 x 101 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 x 4 mils
Metallization Mask Layout
HCTS138MS
NOTE:
The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The
mask series for the HCTS138 is TA14461A.
A1
(2)
A0
(1)
VCC
(16)
A2 (3)
E
1 (4)
E2
(5)
E3 (6)
(8)
GND
(9)
Y6
(10)
Y5
(11)
Y4
(12)
Y3
(13)
Y2
(14)
Y1
(7)
Y7
Y0
(15)
NC
NC
NC
NC
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