Pin Description
Pin Name
I/O
ROM Code
Option
Description
PA0~PA5
PA6/TMR0
PA7/TMR1
I/O
Pull-high
Wake-up
CMOS/NMOS/PMOS
Bidirectional 8-bit input/output port. Each bit can be configured as a
wake-up input by ROM code option. The input or output mode is con-
trolled by PAC (PA control register).
Pull-high resistor options: PA0~PA7
CMOS/NMOS/PMOS options: PA0~PA7
Wake up options: PA0~PA7
PA6andPA7arepin-sharedwithTMR0andTMR1input,respectively.
PB0~PB5
PB6/SCL
PB7/SDA
I/O
Pull-high
Wake-up
Bidirectional 8-bit input/output port. Software instructions determine the
CMOSoutputorSchmitttriggerinputwithpull-highresistor(determined
by pull-high options).
Wake-up options: PB0~PB5
Falling edge wake-up options: PB6, PB7
PB6 is wire-bonded with SCL pad of the Data EEPROM
PB7 is wire-bonded with SDA pad of the Data EEPROM
PD0~PD7
I/O
Pull-high
Wake-up
Bidirectional I/O lines. Software instructions determine the CMOS out-
put or Schmitt trigger input with pull-high resistor (determined by
pull-high options).
Wake-up options: PD0~PD7
VSS
Negative power supply, ground
PC0~PC7
I/O
Pull-high
Wake-up
Bidirectional I/O lines. Software instructions determine the CMOS out-
put or Schmitt trigger input with pull-high resistor (determined by
pull-high options).
Wake-up options: PC0~PC7
RES
I
Schmitt trigger reset input. Active low
VDD
Positive power supply
V33O
O
3.3V regulator output
USBD+/CLK
I/O
USBD+ or PS2 CLK I/O line
USB or PS2 function is controlled by software control register
USBD-/DATA
I/O
USBD- or PS2 DATA I/O line
USB or PS2 function is controlled by software control register
OSC1
OSC2
I
O
OSC1, OSC2 are connected to a 6MHz or 12MHz Crystal/resonator
(determined by software instructions) for the internal system clock.
Absolute Maximum Ratings
Supply Voltage...........................V
SS
0.3V to V
SS
+6.0V
Storage Temperature............................ 50 C to 125 C
Input Voltage..............................V
SS
0.3V to V
DD
+0.3V
Operating Temperature...............................0 C to 70 C
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.
HT82K95EE/HT82K95AE
Rev. 1.20
3
August 28, 2006