參數(shù)資料
型號(hào): HSDL-3602-038
廠商: Avago Technologies Ltd.
英文描述: IrDA㈢ Data 1.4 Compliant 4 Mb/s 3V Infrared Transceiver
中文描述: ㈢數(shù)據(jù)的IrDA 1.4兼容4 Mb / s的3V的紅外收發(fā)器
文件頁(yè)數(shù): 15/27頁(yè)
文件大?。?/td> 388K
代理商: HSDL-3602-038
15
Adjacent land keep-out is the maximum space oc-
cupied by the unit relative to the land pattern. There
should be no other SMD components within this
area.
“h” is the minimum solder resist strip width required
to avoid solder bridging adjacent pads.
It is recommended that 2 fiducial cross be placed at
mid-length of the pads for unit alignment.
Note : Wet/Liquid Photo-Imagineable solder resist/mask
is recommended.
1.2. Adjacent Land Keep-out and Solder Mask Areas
Dim.
mm inches
h
min. 0.2 min. 0.008
j
13.4 0.528
k
4.7 0.185
l
3.2 0.126
Figure 3. HSDL-3602-007/-037 PCBA-Adjacent land keep-out and solder mask.
h
l
Rx LENS
Tx LENS
DIM.
mm
INCHES
h
j
k
l
MIN. 0.2
13.4
4.7
3.2
MIN. 0.008
0.528
0.185
0.126
j
SOLDER
MASK
LAND
k
ADJACENT LAND KEEP-OUT IS THE
MAXIMUM SPACE OCCUPIED BY THE
UNIT RELATIVE TO THE LAND PATTERN.
THERE SHOULD BE NO OTHER SMD
COMPONENTS WITHIN THIS AREA.
"h" IS THE MINIMUM SOLDER RESIST
STRIP WIDTH REQUIRED TO AVOID
SOLDER BRIDGING ADJACENT PADS.
IT IS RECOMMENDED THAT 2 FIDUCIAL
CROSS BE PLACED AT MID-LENGTH OF
THE PADS FOR UNIT ALIGNMENT.
Y
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