2
Order Information
Part Number
Packaging Type
Package
Quantity
HSDL-3220-021
Tape and Reel
Front View
2500
HSDL-3220-001
Tape and Reel
Front View
500
I/O Pins Configuration Table
Pin
Symbol
Description
I/O Type
Notes
1
LED A
LED Anode
I
1
2
LED C
LED Cathode
2
3
TXD
Transmit Data. Active High.
I
3
4
RXD
Receive Data. Active Low.
O
4
5
SD
Shutdown. Active High.
I
5
6
Vcc
Supply Voltage
6
7
IOVcc
Input/Output ASIC Vcc
7
8
GND
Ground
8
-
Shield
EMI Shield
9
Marking Information
The unit is marked with the
letter “
G
”
and
“
YWWLL
”
on the
shield where:
Y is the last digit of the year
WW is the work week
LL is the lot information
Recommended Application Circuit Components
Component
Recommended Value
Notes
R1
5.6
±
5%, 0.25 watt for 2.7
≤
Vled<3.3V
10
±
5%, 0.25 watt for 3.3
≤
Vled<4.2V
15
±
5%, 0.25 watt for 4.2
≤
Vled<5.5V
0.47
μ
F
±
20%, X7R Ceramic
6.8
μ
F
±
20%, Tantalum
CX1, CX4
10
CX2, CX3
11
Notes:
1. Tied through external series resistor, R1, to regulated Vled from 2.7 to 5.5V. Please refer to table
above for recommended series resistor value.
2. Internally connected to LED driver. Leave this pin unconnected.
3. This pin is used to transmit serial data when SD pin is low. If this pin is held high for longer than
50
μ
s, the LED is turned off. Do NOT float this pin.
4. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull-down
resistor is required. The pin is in tri-state when the transceiver is in shutdown mode. The receiver
output echoes transmitted signal.
5. The transceiver is in shutdown mode if this pin is high for more than 400
μ
s. On falling edge of
this signal, the state of the TXD pin sampled and used to set receiver low bandwidth (TXD=low)
or high bandwidth (TXD=high) mode. Refer to the section ”Bandwidth selection timing” for
programming information. Do NOT float this pin.
6. Regulated, 2.7 to 3.6 Volts.
7. Connect to ASIC logic controller Vcc voltage or supply voltage. The voltage at this pin must be
equal to or less than supply voltage.
8. Connect to system ground.
9. Connect to system ground via a low inductance trace. For best performance, do not connect
directly to the transceiver pin GND.
10. CX1 must be placed within 0.7 cm of the HSDL-3220 to obtain optimum noise immunity.
11. In environments with noisy power supplies, including CX2, as shown in Figure 1, can enhance
supply ripple rejection performance.
Application Support Information
The Application Engineering
Group is available to assist you
with the application design
associated with the HSDL-3220
infrared transceiver module. You
can contact them through your
local sales representatives for
additional details.