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參數(shù)資料
| 型號： | HSDL-3220-021 |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | IrDA㈢ Data Compliant Low Power 4.0 Mbit/s Infrared Transceiver |
| 中文描述： | 紅外線㈢數(shù)據(jù)兼容低功耗4.0 Mbit / s的紅外收發(fā)器 |
| 文件頁數(shù)： | 12/19頁 |
| 文件大?。?/td> | 190K |
| 代理商： | HSDL-3220-021 |
12
Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) or a
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. See the
table below the drawing for
combinations of metal stencil
aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad
is 2.7 mm x 1.25 mm as per land
pattern.
APERTURES AS PER
LAND DIMENSIONS
l
w
t
Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space
occupied by the
unit relative to the land pattern.
There should be no other SMD
components within this area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm.
It is recommended that two
fiducial crosses be place at mid-
length of the pads for unit
alignment.
Note:
Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
Stencil thickness, t (mm)
Aperture size (mm)
length, l
width, w
0.152 mm
2.60
±
0.05
0.55
±
0.05
0.127 mm
3.00
±
0.05
0.55
±
0.05
Figure 14. Solder stencil aperature.
Figure 15. Adjacent land keepout and solder mask areas.
0.2
3.0
10.1
SOLDER MASK
3.85
UNITS: mm
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSDL-3310 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:IrDA 1.3 Data Compliant 1.15Mb/s 3-5V Infrared Transceiver |
| HSDL-3310#007 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Telecomm/Datacomm |
| HSDL-3310#017 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Telecomm/Datacomm |
| HSDL-3600 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:IrDA Compliant 4 Mb/s 3 V Infrared Transceiver |
| HSDL-3600#007 | 制造商:Hewlett Packard Co 功能描述:SPECIALTY INTERFACE CIRCUIT, SMA10 |
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