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參數(shù)資料
| 型號(hào)： | HSDL-3210 |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | IrDA㈢ Compliant Low Power 1.15 Mbit/s Infrared Transceiver |
| 中文描述： | 紅外㈢符合低功耗1.15 Mbit / s的紅外收發(fā)器 |
| 文件頁(yè)數(shù)： | 11/24頁(yè) |
| 文件大?。?/td> | 475K |
| 代理商： | HSDL-3210 |
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11
Reflow Profile
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
T
25C to 125C
125C to 170C
170C to 230C (245C at 10 seconds max.)
230C to 170C
170C to 25C
Maximum
T/
time
4C/s
0.5C/s
4C/s
–4C/s
–3C/s
Cool Down
Figure 11. Reflow graph.
The reflow profile is a straight
line representation of a nominal
temperature profile for a convec-
tive reflow solder process. The
temperature profile is divided
into four process zones, each
with different
T/
time tempera-
ture change rates. The
T/
time
rates are detailed in the above
table. The temperatures are
measured at the component to
printed circuit board connections.
In
process zone P1
, the PC board
and HSDL-3210 castellation I/O
pins are heated to a temperature
of 125
°
C to activate the flux in
the solder paste. The temperature
ramp up rate, R1, is limited to
4
°
C per second to allow for even
heating of both the PC board and
HSDL-3210 castellation I/O pins.
Process zone P2
should be of
sufficient time duration (> 60
seconds) to dry the solder paste.
The temperature is raised to a
level just below the liquidus point
of the solder, usually 170
°
C
(338
°
F).
Process zone P3
is the solder
reflow zone. In zone P3, the tem-
perature is quickly raised above
the liquidus point of solder to
230
°
C (446
°
F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 15 and 90 seconds. It
usually takes about 15 seconds to
assure proper coalescing of the
solder balls into liquid solder and
the formation of good solder
connections. Beyond a dwell
time of 90 seconds, the inter-
metallic growth within the solder
connections becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 170
°
C (338
°
F), to allow
the solder within the connections
to freeze solid.
Process zone P4
is the cool down
after solder freeze. The cool
down rate, R5, from the liquidus
point of the solder to 25
°
C (77
°
F)
should not exceed –3
°
C per sec-
ond maximum. This limitation is
necessary to allow the PC board
and HSDL-3210 castellation I/O
pins to change dimensions
evenly, putting minimal stresses
on the HSDL-3210 transceiver.
0
t-TIME (SECONDS)
T
–
–
°
C
200
183
170
150
125
100
50
50
150
100
200
250
300
230
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL
DOWN
25
R1
R2
R3
R4
R5
90 sec.
MAX.
ABOVE
183
°
C
MAX. 245
°
C
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSDL-3210-021 | 功能描述:紅外收發(fā)器 20-30cm MIR RoHS:否 制造商:Vishay Semiconductors 波長(zhǎng):900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強(qiáng)度:60 mW/sr 半強(qiáng)度角度:44 deg 脈沖寬度:2 us 最大上升時(shí)間:100 ns 最大下降時(shí)間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| HSDL-3211 | 制造商:AVAGO 制造商全稱(chēng):AVAGO TECHNOLOGIES LIMITED 功能描述:IrDA㈢ Data Compliant Low Power 1.15 Mbit/s Infrared Transceiver |
| HSDL-3211-021 | 功能描述:紅外收發(fā)器 Short Distance 3V M IR RoHS:否 制造商:Vishay Semiconductors 波長(zhǎng):900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強(qiáng)度:60 mW/sr 半強(qiáng)度角度:44 deg 脈沖寬度:2 us 最大上升時(shí)間:100 ns 最大下降時(shí)間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| HSDL-3220 | 制造商:Avago Technologies 功能描述:TRANSCEIVER IRDA 4MB/S |
| HSDL-3220-001 | 制造商:AVAGO 制造商全稱(chēng):AVAGO TECHNOLOGIES LIMITED 功能描述:IrDA㈢ Data Compliant Low Power 4.0 Mbit/s Infrared Transceiver |
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