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參數(shù)資料
| 型號： | HS1-3374 |
| 廠商： | Intersil Corporation |
| 英文描述： | Radiation Hardened 8-Bit Bidirectional CMOS/TTL Level Converter |
| 中文描述： | 輻射加固8位雙向的CMOS / TTL電平轉(zhuǎn)換器 |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 38K |
| 代理商： | HS1-3374 |
6
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
HS-3374RH
Metallization Topology
DIE DIMENSIONS:
89.4 mils x 76.0 mils x 14 mils
±
1 mil
METALLIZATION:
Type: AlSi
Thickness: 8k
±
1k
GLASSIVATION:
Type: SiO2
Thickness: 11k
±
2k
Metallization Mask Layout
HS-3374RH
(20) B1
A2 (4)
(19) B2
(18) B3
(17) B4
(16) B5
(15) B6
(14) B7
A3 (5)
A4 (6)
A5 (7)
A6 (8)
A7 (9)
(
(
(
(
(
D
G
E
Spec Number
518052
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HS1-3374RH-8 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened 8-Bit Bidirectional CMOS/TTL Level Converter |
| HS1-3374RH-Q | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened 8-Bit Bidirectional CMOS/TTL Level Converter |
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| HS1350-1002FA-RG-HS-FTB | 制造商:Lista International Corp 功能描述:HS1350-10 COMBINATION CONSISTING OF: HS CABINET, W/DRAWER LAYOUT, LOCK, HS FO |
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