
2
Specifications HS-3374RH
Absolute Maximum Ratings
Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+11.0V
I/O Voltage Applied. . . . . . . . . . . . . . . . . . . GND-0.3V to VDD+0.3V
Storage Temperature Range . . . . . . . . . . . . . . . . . -65
o
C to +150
o
C
Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175
o
C
Lead Temperature (Soldering 10s). . . . . . . . . . . . . . . . . . . . +300
o
C
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Thermal Resistance (Typical)
SBDIP Package. . . . . . . . . . . . . . . . . .
Maximum Package Power Dissipation at +125
o
C
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.67W
If Device Power Exceeds Package Dissipation Capability, Provide
Heat Sinking or Derate Linearly at the Following Rate:
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13.4mW/
o
C
θ
JA
(
o
C/W)
74.8
θ
JC
(
o
C/W)
12.3
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Operating Conditions
Operating Voltage Range
VDD . . . . . . . . . . . . . +9.5V to +10.5V
VCC . . . . . . . . . . . . +4.75V to +5.25V
Operating Temperature Range. . . . . . . . . . . . . . . . -55
o
C to +125
o
C
Input Voltage Range
Data Inputs (CMOS) . . . . . . . . . . . . . . . . . . .GND-0.3 to VDD+0.3
Data Inputs (TTL) . . . . . . . . . . . . . . . . . . . . .GND-0.3 to VCC+0.3
Enable, Disable Inputs . . . . . . . . . . . . . . . . .GND-0.3 to VDD+0.3
Input Low Voltage (CMOS) . . . . . . . . . . . . . . . . . . . . . . . GND to 1V
Input High Voltage (CMOS). . . . . . . . . . . . . . . . . .VDD-1.0V to VDD
Input Low Voltage (TTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8V
Input High Voltage (TTL). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.8V
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
SYMBOL
CONDITIONS
GROUP A
SUBGROUPS
TEMPERATURE
LIMITS
UNITS
MIN
MAX
ENABLE AND DISABLE IINPUTS
Input Leakage Current
IIH CMOS
VDD = 10.5V, VCC = 5.25V,
VIN = 10.5V, Floating Outputs
1, 2, 3
-55
o
C, +25
o
C,
+125
o
C
-
1
μ
A
TTL INPUT TO CMOS OUTPUTS
Input Leakage Current
IIL IIH
VDD = 10.5V, VCC = 5.25V,
VIN = 0.8V, Other Inputs at 2.8V
1, 2, 3
-55
o
C, +25
o
C,
+125
o
C
-1
-
μ
A
VDD = 10.5V, VCC = 5.25V,
VIN = 2.8V, other Inputs = 0.8V
1, 2, 3
-55
o
C, +25
o
C,
+125
o
C
-
1
μ
A
High Level Output
Voltage
VOH
VDD = 9.5V, VCC = 4.75V,
VIH = 2.8V, VIL = 0.8V,
IOH = -2.0mA
1, 2, 3
-55
o
C, +25
o
C,
+125
o
C
9
-
V
Low level output
Voltage
VOL
VDD = 10.5V, VCC = 5.25V,
VIH = 2.8V, VIL 0.8V,
IOL = 2.0mA
1, 2, 3
-55
o
C, +25
o
C,
+125
o
C
-
0.5
V
CMOS to TTL OUTPUTS
High Level Output
Voltage
VOH
VDD = 9.5, VCC = 4.75V,
VIH = 8.5V, VIL = 1.0V,
IOH = -2.0mA
1, 2, 3
-55
o
C, +25
o
C,
+125
o
C
3
-
V
Low Level Output
Voltage
VOL
VDD = 10.5V, VCC = 5.25V,
VIH = 9.5V, VIL = 1.0V,
IOL = 11mA
1, 2, 3
-55
o
C, +25
o
C,
+125
o
C
-
0.4
V
Output Leakage
Current
IOZL
VDD = 10.5V, VCC = 5.25V,
VIN = 0V, All other pins high
1, 2, 3
-55
o
C, +25
o
C,
+125
o
C
-10
-
μ
A
IOZH
VDD = 10.5V, VCC = 5.25V,
VIN = 2.8V, All other pins at
GND
1, 2, 3
-55
o
C, +25
o
C,
+125
o
C
-
10
μ
A
Spec Number
518052