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參數(shù)資料
| 型號： | HMC448 |
| 廠商： | 美國訊泰微波有限公司上海代表處 |
| 英文描述： | GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 19 - 25 GHz OUTPUT |
| 中文描述： | 砷化鎵微波單片集成電路有源x2倍頻，19 - 25 GHz輸出 |
| 文件頁數(shù)： | 4/6頁 |
| 文件大?。?/td> | 228K |
| 代理商： | HMC448 |
MICROWAVE CORPORATION
4 - 31
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
F
4
HMC448
v00.0902
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 19 - 25 GHz OUTPUT
Absolute Maximum Ratings
Outline Drawing
RF Input (Vcc= +5V)
+20 dBm
Supply Voltage (Vd1, Vd2)
+6.0 Vdc
Channel Temperature
175 °C
Continuous Pdiss (T= 85 °C)
(derate 8.3 mW/°C above 85 °C)
744 mW
Thermal Resistance
(junction to die bottom)
121 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-55 to +85 °C
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE.
4. TYPICAL BOND SPACING IS .006” CENTER TO CENTER.
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METALIZATION: GOLD
7. BACKSIDE METAL IS GROUND.
8. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS.
Typical Supply Current vs. Vdd
Vdd (Vdc)
Idd (mA)
4.5
47
5.0
48
5.5
49
Note: Multiplier will operate over full voltage
range shown above
.
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| HMC450QS16G | GaAs InGaP HBT MMIC POWER AMPLIFIER, 0.8 - 1.0 GHz |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMC448_06 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 19 - 25 GHz OUTPUT |
| HMC448_09 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 19 - 25 GHz OUTPUT |
| HMC448LC3B | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 20 - 25 GHz OUTPUT |
| HMC448LC3B_09 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 20 - 25 GHz OUTPUT |
| HMC448LC3BTR | 制造商:Hittite Microwave Corp 功能描述:IC MULTIPLIER X2 BB 12SMD |
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