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參數(shù)資料
| 型號(hào)： | HMC337 |
| 廠商： | 美國(guó)訊泰微波有限公司上海代表處 |
| 元件分類(lèi)： | FPGA |
| 英文描述： | 600000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| 中文描述： | 砷化鎵微波單片集成電路二次諧波泵混合器，17 - 25千兆赫 |
| 文件頁(yè)數(shù)： | 6/8頁(yè) |
| 文件大小： | 286K |
| 代理商： | HMC337 |
MICROWAVE CORPORATION
5 - 99
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
M
5
Pad Number
Function
Description
Interface Schematic
1
Vdd
Power supply for the LO Amplifier. An external RF bypass
capacitor of 100 - 330 pF is required. A MIM border capacitor is
recommended. The bond length to the capacitor should be as
short as possible. The ground side of the capacitor should be
connected to the housing ground.
2
RF Port
RF Port. This pad is AC coupled and matched to 50 Ohm from
15 - 30 GHz.
3
IF Port
IF Port. This pad is DC coupled and should be DC blocked
externally using a series capacitor whose value has been
chosen to pass the necessary IF frequency range. Any applied
DC voltage to this pin will result in die non-function and possible
die failure.
4
LO Port
LO Port. This pad is AC coupled and matched to 50 ohm from
8 - 12 GHz
Outline Drawing
HMC337
GaAs MMIC SUB-HARMONICALLY
PUMPED MIXER, 17 - 25 GHz
Pad Descriptions
v01.0803
NOTES:
1. ALL DIMENSIONS IN INCHES (MILLIMETERS)
2. ALL TOLERANCES ARE ±0.001 (0.025)
3. DIE THICKNESS IS 0.004 (0.100) BACKSIDE IS GROUND
4. BOND PADS ARE 0.004 (0.100) SQUARE
5. BOND PAD SPACING, CTR-CTR: 0.006 (0.150)
6. BACKSIDE METALLIZATION: GOLD
7. BOND PAD METALLIZATION: GOLD
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PDF描述 |
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| HMC338LC3B | GaAs MMIC SUB-HARMONIC SMT MIXER, 24 - 34 GHz |
| HMC338 | 600,000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| HMC339 | 600000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| HMC340LP5 | 600,000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMC337_07 | 制造商:HITTITE 制造商全稱(chēng):Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 17 - 25 GHz |
| HMC337_09 | 制造商:HITTITE 制造商全稱(chēng):Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 17 - 25 GHz |
| HMC337-SX | 功能描述:IC MIXER SUB-HARMONIC DIE 制造商:analog devices inc. 系列:- 包裝:散裝 零件狀態(tài):在售 RF 類(lèi)型:通用 頻率:17GHz ~ 25GHz 混頻器數(shù):1 增益:- 噪聲系數(shù):9dB 輔助屬性:升/降頻器 電流 - 電源:28mA 電壓 - 電源:3 V ~ 4 V 封裝/外殼:模具 供應(yīng)商器件封裝:模具 標(biāo)準(zhǔn)包裝:2 |
| HMC338 | 制造商:HITTITE 制造商全稱(chēng):Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 26 - 33 GHz |
| HMC338_09 | 制造商:HITTITE 制造商全稱(chēng):Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 26 - 33 GHz |
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