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參數資料
| 型號： | HMC330 |
| 廠商： | 美國訊泰微波有限公司上海代表處 |
| 元件分類： | FPGA |
| 英文描述： | 600000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| 中文描述： | 砷化鎵微波單片集成電路二次諧波泵混合器，25 - 40千兆赫 |
| 文件頁數： | 5/6頁 |
| 文件大?。?/td> | 165K |
| 代理商： | HMC330 |
MICROWAVE CORPORATION
5 - 92
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
M
5
MIC Assembly Techniques
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting,
Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and
from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6
mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4
mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2).
Microstrip substrates should be brought as close to the die as possible in order to minimize ribbon bond length. Typical die-to-sub-
strate spacing is 0.076mm (3 mils). Gold ribbon of 0.075 mm (3 mil) width and minimal length <0.31 mm (<12 mils) is recommended
to minimize inductance on RF, LO & IF ports.
HMC330
v01.0301
GaAs MMIC SUB-HARMONICALLY
PUMPED MIXER, 25 - 40 GHz
3 mil Ribbon Bond
3 mil Ribbon Bond
相關PDF資料 |
PDF描述 |
|---|---|
| HMC331 | GaAs MMIC PASSIVE FREQUENCY DOUBLER, 12 - 18 GHz INPUT |
| HMC332 | 600000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| HMC333 | 600000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| HMC334LP4 | SiGe WIDEBAND DOWNCONVERTER, 0.8 - 2.7 GHz |
| HMC334LP4E | SiGe WIDEBAND DOWNCONVERTER, 0.8 - 2.7 GHz |
相關代理商/技術參數 |
參數描述 |
|---|---|
| HMC330_01 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 25 - 40 GHz |
| HMC330_10 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 25 - 40 GHz |
| HMC331 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC PASSIVE FREQUENCY DOUBLER, 12 - 18 GHz INPUT |
| HMC331_08 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC PASSIVE FREQUENCY DOUBLER, 12 - 18 GHz INPUT |
| HMC331_09 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC PASSIVE FREQUENCY DOUBLER, 12 - 18 GHz INPUT |
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