參數(shù)資料
型號: HMC311LP3
廠商: 美國訊泰微波有限公司上海代表處
英文描述: InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6.0 GHz
中文描述: InGaP HBT增益模塊MMIC放大器,直流- 6.0吉赫
文件頁數(shù): 6/6頁
文件大?。?/td> 264K
代理商: HMC311LP3
MICROWAVE CORPORATION
8 - 67
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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HMC311LP3
InGaP HBT GAIN BLOCK
MMIC AMPLIFIER, DC - 6.0 GHz
v01.0604
Evaluation PCB
The circuit board used in the final application should use
RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads
and exposed paddle should be connected directly to the
ground plane similar to that shown. A sufficient number
of VIA holes should be used to connect the top and
bottom ground planes. The evaluation board should be
mounted to an appropriate heat sink. The evaluation cir-
cuit board shown is available from Hittite upon request.
List of Materials
Item
Description
J1 - J2
PC Mount SMA Connector
J3
2 mm DC Header
C1, C2
Capacitor, 0402 Pkg.
C3
10,000 pF Capacitor, 0805 Pkg.
R1
22 Ohm Resistor, 0805 Pkg.
L1
Inductor, 0805 Pkg.
U1
HMC311LP3
PCB*
106493 Evaluation PCB
* Circuit Board Material: Rogers 4350
Pin Number
Description
1, 2, 3
Vs
4, 5, 6
GND
J3
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相關代理商/技術參數(shù)
參數(shù)描述
HMC311LP3_07 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz
HMC311LP3_09 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz
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