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參數(shù)資料
| 型號： | HMC265LM3 |
| 廠商： | 美國訊泰微波有限公司上海代表處 |
| 元件分類： | FPGA |
| 英文描述： | 600000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| 中文描述： | 砷化鎵微波單片集成電路次諧波貼片混頻器，20 - 31千兆赫 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大小： | 220K |
| 代理商： | HMC265LM3 |
MICROWAVE CORPORATION
5 - 62
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
M
5
MIC Assembly Techniques
Mounting & Bonding Techiniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting,
Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film
substrates are recommended for bringing RF to and from the chip (Figure 1). If
0.254mm (10 mil) thick alumina thin film substrates must be used, the die should
be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the
surface of the substrate. One way to accomplish this is to attach the 0.102mm
(4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab)
which is then attached to the ground plane (Figure 2).
Microstrip substrates should be brought as close to the die as possible in order
to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm (3
mils).
An RF bypass capacitor should be used on the Vdd input. A 100 pF single layer
capacitor (mounted eutectically or by conductive epoxy) placed no further than
0.762mm (30 mils) from the chip is recommended. The photo in figure 3 shows a
typical assembly for the HMC265 MMIC chip.
HMC265
v01.0701
GaAs MMIC SUB-HARMONICALLY
PUMPED DOWNCONVERTER, 20 - 32 GHz
Figure 3:
Typical HMC265 Assembly
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HMC266 | 600000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| HMC268LM1 | SMT LOW NOISE AMPLIFIER MMIC 20 - 32 GHz |
| HMC270MS8G | 600000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| HMC272MS8 | GaAs MMIC SMT SINGLE BALANCED MIXER, 1.7 - 3 GHz |
| HMC273MS10G | 1 dB LSB GaAs MMIC 5-BIT DIGITAL ATTENUATOR, 0.7 - 3.7 GHz |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMC265LM3_06 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz |
| HMC265LM3_08 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz |
| HMC265-SX | 功能描述:IC MIXER SUB-HARMONIC DIE 制造商:analog devices inc. 系列:- 包裝:散裝 零件狀態(tài):在售 RF 類型:通用 頻率:20GHz ~ 32GHz 混頻器數(shù):1 增益:3dB 噪聲系數(shù):13dB 輔助屬性:降頻變頻器 電流 - 電源:50mA 電壓 - 電源:3 V ~ 4 V 封裝/外殼:模具 供應商器件封裝:模具 標準包裝:2 |
| HMC266 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 20 - 40 GHz |
| HMC266_06 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 20 - 40 GHz |
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