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參數(shù)資料
| 型號： | HMC260 |
| 廠商： | 美國訊泰微波有限公司上海代表處 |
| 英文描述： | XCV600-4BGG432C - NOT RECOMMENDED for NEW DESIGN |
| 中文描述： | 砷化鎵微波單片集成電路基本攪拌機(jī)，14 - 26千兆赫 |
| 文件頁數(shù)： | 6/6頁 |
| 文件大小： | 180K |
| 代理商： | HMC260 |
MICROWAVE CORPORATION
5 - 49
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
M
5
Handling Precautions
Follow these precautions to avoid permanent damage.
HMC260
v01.0301
GaAs MMIC FUNDAMENTAL
MIXER, 14 - 26 GHz
Cleanliness:
Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity:
Follow ESD precautions to protect against > ± 250V ESD strikes.
Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize
inductive pick-up.
General Handling:
Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the
chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting
surface should be clean and flat.
Eutectic Die Attach:
A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature
of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip
to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for
attachment.
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
RF bonds made with 0.003” x 0.0005” ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-
60 grams. DC bonds of 0.001” (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with
a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a nominal stage temperature of 150 °C. A
minimum amount of ultrasonic energy should be applied to achieve reliable bonds. All bonds should be as short as possible, less than
12 mils (0.31 mm).
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HMC261LM1 | SMT DISTRIBUTED GaAs MMIC AMPLIFIER 20 - 32 GHz |
| HMC262 | GaAs MMIC LOW NOISE AMPLIFIER 15 - 24 GHz |
| HMC263 | GaAs MMIC LOW NOISE AMPLIFIER, 24 - 36 GHz |
| HMC264LC3B | GaAs MMIC SUB-HARMONIC SMT MIXER, 21 - 31 GHz |
| HMC264LM3 | GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 30 GHz |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMC260_09 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC FUNDAMENTAL MIXER, 14 - 26 GHz |
| HMC260LC3B | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC FUNDAMENTAL MIXER, 14 - 26 GHz |
| HMC260LC3B_09 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC FUNDAMENTAL MIXER, 14 - 26 GHz |
| HMC260LC3BTR | 制造商:Hittite Microwave Corp 功能描述:IC MIXER FUNDAMENTAL 12SMD 制造商:Hittite Microwave Corp 功能描述:NA ONLY -HMC260 Series GaAs MMIC 14 to 26 GHz 7.5 dB Loss Fundamental Mixer SMT 制造商:Hittite Microwave Corp 功能描述:HMC260 Series GaAs MMIC 14 to 26 GHz 7.5 dB Loss Fundamental Mixer SMT |
| HMC261 | 制造商:Hittite Microwave Corp 功能描述: |
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