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參數(shù)資料
| 型號： | HMC260 |
| 廠商： | 美國訊泰微波有限公司上海代表處 |
| 英文描述： | XCV600-4BGG432C - NOT RECOMMENDED for NEW DESIGN |
| 中文描述： | 砷化鎵微波單片集成電路基本攪拌機(jī)，14 - 26千兆赫 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 180K |
| 代理商： | HMC260 |
MICROWAVE CORPORATION
5 - 48
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
M
5
HMC260
v01.0301
MIC Assembly Techniques
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting,
Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and
from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6
mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4
mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2).
Microstrip substrates should be brought as close to the die as possible in order to minimize ribbon bond length. Typical die-to-substrate
spacing is 0.076mm (3 mils). Gold ribbon of 0.075 mm (3 mil) width and minimal length <0.31 mm (<12 mils) is recommended to
minimize inductance on RF, LO & IF ports.
GaAs MMIC FUNDAMENTAL
MIXER, 14 - 26 GHz
Ribbon Bond
Ribbon Bond
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HMC261LM1 | SMT DISTRIBUTED GaAs MMIC AMPLIFIER 20 - 32 GHz |
| HMC262 | GaAs MMIC LOW NOISE AMPLIFIER 15 - 24 GHz |
| HMC263 | GaAs MMIC LOW NOISE AMPLIFIER, 24 - 36 GHz |
| HMC264LC3B | GaAs MMIC SUB-HARMONIC SMT MIXER, 21 - 31 GHz |
| HMC264LM3 | GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 30 GHz |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMC260_09 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC FUNDAMENTAL MIXER, 14 - 26 GHz |
| HMC260LC3B | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC FUNDAMENTAL MIXER, 14 - 26 GHz |
| HMC260LC3B_09 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC FUNDAMENTAL MIXER, 14 - 26 GHz |
| HMC260LC3BTR | 制造商:Hittite Microwave Corp 功能描述:IC MIXER FUNDAMENTAL 12SMD 制造商:Hittite Microwave Corp 功能描述:NA ONLY -HMC260 Series GaAs MMIC 14 to 26 GHz 7.5 dB Loss Fundamental Mixer SMT 制造商:Hittite Microwave Corp 功能描述:HMC260 Series GaAs MMIC 14 to 26 GHz 7.5 dB Loss Fundamental Mixer SMT |
| HMC261 | 制造商:Hittite Microwave Corp 功能描述: |
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