
3
Ordering Information
PART
NUMBER
PART
MARKING
TEMP.
RANGE
(
o
C)
PACKAGE
PKG.
DWG. #
HIN232CB
232CB
0 to 70
16 Ld SOIC
M16.3
HIN232CB-T
232CB
0 to 70
Tape and Reel
HIN232CBZ
(See Note)
232CBZ
0 to 70
16 Ld SOIC
(Pb-free)
M16.3
HIN232CBZ-T
(See Note)
232CBZ
0 to 70
Tape and Reel (Pb-free)
HIN232CP
HIN232CP
0 to 70
16 Ld PDIP
E16.3
HIN232CPZ
(See Note)
HIN232CPZ
0 to 70
16 Ld PDIP*
(Pb-free)
E16.3
HIN232IB
232IB
-40 to 85 16 Ld SOIC
M16.3
HIN232IB-T
232IB
-40 to 85 Tape and Reel
HIN232IBZ
(See Note)
232IBZ
-40 to 85 16 Ld SOIC
(Pb-free)
M16.3
HIN232IBZ-T
(See Note)
232IBZ
-40 to 85 Tape and Reel (Pb-free)
HIN232IP
HIN232IP
-40 to 85 16 Ld PDIP
E16.3
HIN232IPZ
(See Note)
HIN232IPZ
-40 to 85 16 Ld PDIP*
(Pb-free)
E16.3
HIN236CB
236CB
0 to 70
24 Ld SOIC
M24.3
HIN236CBZ
(See Note)
236CBZ
0 to 70
24 Ld SOIC
(Pb-free)
M24.3
HIN237CB
237CB
0 to 70
24 Ld SOIC
M24.3
HIN237CB-T
237CB
0 to 70
Tape and Reel
HIN237CBZ
(See Note)
237CBZ
0 to 70
24 Ld SOIC
(Pb-free)
M24.3
HIN237CBZ-T
(See Note)
237CBZ
0 to 70
Tape and Reel (Pb-free)
HIN238CB
238CB
0 to 70
24 Ld SOIC
M24.3
HIN238CB-T
238CB
0 to 70
Tape and Reel
HIN238CBZ
(See Note)
238CBZ
0 to 70
24 Ld SOIC
(Pb-free)
M24.3
HIN238CBZ-T
(See Note)
238CBZ
0 to 70
Tape and Reel (Pb-free)
HIN238CP
HIN238CP
0 to 70
24 Ld PDIP
E24.3
HIN238CPZ
(See Note)
HIN238CPZ
0 to 70
24 Ld PDIP*
(Pb-free)
E24.3
HIN238IB
238IB
-40 to 85 24 Ld SOIC
M24.3
HIN238IBZ
(See Note)
238IBZ
-40 to 85 24 Ld SOIC
(Pb-free)
M24.3
HIN239CB
239CB
0 to 70
24 Ld SOIC
M24.3
HIN239CB-T
239CB
0 to 70
Tape and Reel
HIN239CBZ
(See Note)
239CBZ
0 to 70
24 Ld SOIC
(Pb-free)
M24.3
HIN239CBZ-T
(See Note)
239CBZ
0 to 70
Tape and Reel (Pb-free)
HIN239CP
HIN239CP
0 to 70
24 Ld PDIP
E24.3
HIN239CPZ
(See Note)
HIN239CPZ
0 to 70
24 Ld PDIP*
(Pb-free)
E24.3
HIN240CN
HIN240CN
0 to 70
44 Ld MQFP
Q44.10X10
HIN240CNZ
(See Note)
HIN240CNZ
0 to 70
44 Ld MQFP
(Pb-free)
Q44.10X10
HIN240CNZ-T
(See Note)
HIN240CNZ
0 to 70
44 Ld MQFP Tape and Reel
(Pb-free)
HIN241CA
HIN241CA
0 to 70
28 Ld SSOP
M28.209
HIN241CAZ
(See Note)
HIN241CAZ
0 to 70
28 Ld SSOP
(Pb-free)
M28.209
HIN241CB
241CB
0 to 70
28 Ld SOIC
M28.3
HIN241CB-T
241CB
0 to 70
Tape and Reel
HIN241CBZ
(See Note)
241CBZ
0 to 70
28 Ld SOIC
(Pb-free)
M28.3
HIN241CBZ-T
(See Note)
241CBZ
0 to 70
Tape and Reel (Pb-free)
HIN241IB
241IB
-40 to 85 28 Ld SOIC
M28.3
HIN241IBZ
(See Note)
241IBZ
-40 to 85 28 Ld SOIC
(Pb-free)
M28.3
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
Ordering Information
(Continued)
PART
NUMBER
PART
MARKING
TEMP.
RANGE
(
o
C)
PACKAGE
PKG.
DWG. #
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241