參數(shù)資料
型號(hào): HI5735KCP
廠商: HARRIS SEMICONDUCTOR
元件分類: DAC
英文描述: 12-Bit, 80 MSPS, High Speed Video D/A Converter
中文描述: PARALLEL, WORD INPUT LOADING, 0.02 us SETTLING TIME, 12-BIT DAC, PDIP28
文件頁數(shù): 11/12頁
文件大?。?/td> 136K
代理商: HI5735KCP
1631
HI5735
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS
-
3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and
are measured with the leads constrained to be perpendic-
ular to datum
.
7. e
B
and e
C
are measured at the lead tips with the leads unconstrained.
e
C
must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
e
A
-C-
C
e
A
E
C
e
B
e
C
-B-
E1
INDEX
AREA
1 2
3
N/2
N
SEATING
PLANE
BASE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25)
C
A
M
B S
E28.6
(JEDEC MS-001-BF ISSUE D)
28 LEAD NARROW BODY DUAL-IN-LINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.250
-
6.35
4
A1
0.015
-
0.39
-
4
A2
0.125
0.195
3.18
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.030
0.070
0.77
1.77
8
C
0.008
0.015
0.204
0.381
-
D
1.380
1.565
35.1
39.7
5
D1
0.005
-
0.13
-
5
E
0.600
0.625
15.24
15.87
6
E1
0.485
0.580
12.32
14.73
5
e
0.100 BSC
2.54 BSC
-
e
A
e
B
L
0.600 BSC
15.24 BSC
6
-
0.700
-
17.78
7
0.115
0.200
2.93
5.08
4
N
28
28
9
Rev. 0 12/93
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