
A
defined in Figure 3, no load
pin 1 = logic 1
pin 1 = logic 1
HI-8585, HI-8586
Notes:
1. All data taken in still air on devices soldered to single layer copper PCB (3" X 4.5" X .062").
2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.
4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF
as this is considered unrealistic for high speed operation.
5. 8 Lead Plastic SOIC (Thermally enhanced with built in heat sink). Heat sink not soldered to the PCB.
6. 8 Lead Plastic SOIC (Thermally enhanced with built in heat sink). Heat sink soldered to the PCB.
7. Similar results would be obtained with TXAOUT shorted to TXBOUT.
8. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.
9. Data will vary depending on air flow and the method of heat sinking employed.
PACKAGE THERMAL CHARACTERISTICS
SUPPLY CURRENT (mA)
2
Ta = 25
o
C
Ta = 85
o
C
JUNCTION TEMP, Tj (°C)
Ta = 25
o
C
Ta = 85
o
C
Ta=125
o
C
Ta=125
o
C
Low Speed
3
High Speed
4
Low Speed
High Speed
Low Speed
High Speed
16.8
27.3
17.4
27.6
17.1
27.3
17.2
26.7
17.5
27.1
17.2
27.1
16.9
25.9
16.9
25.9
16.7
26.2
58
75
68
97
52
57
116
132
126
147
110
112
157
169
166
186
151
157
SUPPLY CURRENT (mA)
2
Ta = 25
o
C
Ta = 85
o
C
53.6
50.7
46.9
38.7
46.4
47.6
42.1
43.8
48.5
45.6
46.8
41.1
JUNCTION TEMP, Tj (°C)
Ta = 25
o
C
Ta = 85
o
C
131
181
135
181
167
191
177
212
112
161
116
168
Ta=125
o
C
52.2
42.5
68.1
67.1
46.1
40.5
Ta=125
o
C
217
219
221
223
186
197
Low Speed
3
High Speed
4
Low Speed
High Speed
Low Speed
High Speed
8 Lead Plastic SOIC
6
PACKAGE STYLE
1
MAXIMUM ARINC LOAD
9
ARINC 429
DATA RATE
TXAOUT and TXBOUT Shorted to Ground
7, 8, 9
ARINC 429
DATA RATE
8 Lead Plastic SOIC
5
8 Lead Plastic SOIC
6
PACKAGE STYLE
1
8 Lead Plastic DIP
8 Lead Plastic DIP
8 Lead Plastic SOIC
5
Notes:
1. Guaranteed but not tested
HOLT INTEGRATED CIRCUITS
4