參數(shù)資料
型號(hào): HFA3861B
廠商: Intersil Corporation
元件分類: 基帶處理器
英文描述: Direct Sequence Spread Spectrum Baseband Processor(直接序列擴(kuò)譜基帶處理器)
中文描述: 直接序列擴(kuò)頻基帶處理器(直接序列擴(kuò)譜基帶處理器)
文件頁數(shù): 33/37頁
文件大?。?/td> 284K
代理商: HFA3861B
33
Absolute Maximum Ratings
Thermal Information
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.0V
Input, Output or I/O Voltage. . . . . . . . . . . .GND -0.5V to V
CC
+0.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Class 2
Operating Conditions
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . .+2.70V to +3.60V
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to 85
o
C
Thermal Resistance (Typical, Note 4)
TQFP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Storage Temperature Range. . . . . . . . . . -65
o
C to 150
o
C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
o
C
(Lead Tips Only)
θ
JA
(
o
C/W)
60
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175,000 Gates
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
4.
θ
JA
is measured with the component mounted on a low effective thermal conductivity test board in free air (see Tech Brief TB379 for details).
DC Electrical Specifications
V
CC
= 3.0V to 3.3V
±
10%, T
A
= -40
o
C to 85
o
C
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Power Supply Current
I
CCOP
V
CC
= 3.6V, CLK Frequency 44MHz
(Notes 5, 6, 7)
-
50
60
mA
Standby Power Supply Current
I
CCSB
I
I
I
O
V
IH
V
IL
V
OH
V
OL
C
IN
C
OUT
V
CC
= Max, Outputs Not Loaded
V
CC
= Max, Input = 0V or V
CC
V
CC
= Max, Input = 0V or V
CC
V
CC
= Max, Min
V
CC
= Min, Max
I
OH
= -1mA, V
CC
= Min
I
OL
= 2mA, V
CC
= Min
CLK Frequency 1MHz. All measurements
referenced to GND. T
A
= 25
o
C, Note 6
-
0.5
1
mA
Input Leakage Current
-10
1
10
μ
A
Output Leakage Current
-10
1
10
μ
A
Logical One Input Voltage
0.7 V
CC
-
-
-
V
Logical Zero Input Voltage
-
V
CC
/3
-
V
Logical One Output Voltage
V
CC
-0.2
-
-
V
Logical Zero Output Voltage
0.1
0.2
V
Input Capacitance
-
5
10
pF
Output Capacitance
-
5
10
pF
NOTES:
5. Output load 40pF.
6. Not tested, but characterized at initial design and at major process/design changes.
7. User must allow for a peak current of 100mA that lasts for 20
μ
s when CIR estimate is being calculated.
AC Electrical Specifications
V
CC
= 3.0V to 3.3V
±
10%, T
A
= -40
o
C to 85
o
C (Note 8)
PARAMETER
SYMBOL
MCLK = 44MHz
UNITS
MIN
MAX
MCLK Period
t
CP
22.5
-
ns
MCLK Duty Cycle
40/60
60/40
%
Rise/Fall (All Outputs)
-
10
ns (Notes 9, 10)
TX_PE to I
OUT
/Q
OUT
(1st Valid Chip)
t
D1
2.18
2.3
μ
s (Notes 9, 11)
TX_PE Inactive Width
t
TLP
2.22
-
μ
s (Notes 9, 12)
TX_CLK Width Hi or Low
t
TCD
40
-
ns
TX_RDY Active to 1st TX_CLK Hi
t
RC
260
-
ns
Setup TXD to TX_CLK Hi
t
TDS
30
-
ns
Hold TXD to TX_CLK Hi
t
TDH
0
-
ns
TX_CLK to TX_PE Inactive (1Mbps)
t
PEH
0
965
ns (Notes 9, 20)
TX_CLK to TX_PE Inactive (2Mbps)
t
PEH
0
420
ns (Notes 9, 20)
TX_CLK to TX_PE Inactive (5.5Mbps)
t
PEH
0
160
ns (Notes 9, 20)
HFA3861B
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