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參數(shù)資料
| 型號(hào)： | HCTS541HMSR |
| 廠商： | INTERSIL CORP |
| 元件分類： | 通用總線功能 |
| 英文描述： | Radiation Hardened Non-Inverting Octal Buffer/Line Driver, Three-State |
| 中文描述： | HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, UUC20 |
| 封裝： | DIE-20 |
| 文件頁(yè)數(shù)： | 6/10頁(yè) |
| 文件大?。?/td> | 126K |
| 代理商： | HCTS541HMSR |
687
Specifications HCTS541MS
TABLE 6. APPLICABLE SUBGROUPS
CONFORMANCE GROUPS
METHOD
GROUP A SUBGROUPS
READ AND RECORD
Initial Test (Preburn-In)
100%/5004
1, 7, 9
ICC, IOL/H, IOZL/H
Interim Test
I
(Postburn-In)
100%/5004
1, 7, 9
ICC, IOL/H, IOZL/H
Interim Test
II
(Postburn-In)
100%/5004
1, 7, 9
ICC, IOL/H, IOZL/H
PDA
100%/5004
1, 7, 9, Deltas
Interim Test
III
(Postburn-In)
100%/5004
1, 7, 9
PDA
100%/5004
1, 7, 9, Deltas
Final Test
100%/5004
2, 3, 8A, 8B, 10, 11
Group A (Note 1)
Sample/5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11
Group B
Subgroup B-5
Sample/5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas
Subgroups 1, 2, 3, 9, 10, 11
Subgroup B-6
Sample/5005
1, 7, 9
Group D
Sample/5005
1, 7, 9
NOTE: 1. Alternated Group A Inspection in accordance with Method 5005 of MIL-STD-883 may be exercised.
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE
GROUPS
METHOD
TEST
READ AND RECORD
PRE RAD
POST RAD
PRE RAD
POST RAD
Group E Subgroup 2
5005
1, 7, 9
Table 4
1, 9
Table 4 (Note 1)
NOTE: 1. Except FN test which will be performed 100% Go/No-Go.
TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS
OPEN
GROUND
1/2 VCC = 3V
±
0.5V
VCC = 6V
±
0.5V
OSCILLATOR
50kHz
25kHz
STATIC BURN-IN I TEST CONNECTIONS (Note 1)
11 - 18
1 - 10, 19
-
20
-
-
STATIC BURN-IN II TEST CONNECTIONS (Note 1)
11 - 18
10
-
1 - 9, 19, 20
-
-
DYNAMIC BURN-IN TEST CONNECTIONS (Note 2)
-
10
11 - 18
20
1, 19
2 - 9
NOTES:
1. Each pin except VCC and GND will have a resistor of 10k
±
5% for static burn-in
2. Each pin except VCC and GND will have a resistor of 680
±
5% for dynamic burn-in
TABLE 9. IRRADIATION TEST CONNECTIONS
OPEN
GROUND
VCC = 5V
±
0.5V
11 - 18
10
1 - 9, 19, 20
NOTE: Each pin except VCC and GND will have a resistor of 47K
±
5% for irradiation testing.
Group E, Subgroup 2, sample size is 4 dice/wafer 0 failures.
Spec Number
518630
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