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參數(shù)資料
| 型號： | HCPL-J454 |
| 英文描述： | High CMR, High Speed Optocouplers(高CMR，高速光耦合器) |
| 中文描述： | 高CMR，高速光電耦合器（高公路貨運，高速光耦合器） |
| 文件頁數(shù)： | 7/19頁 |
| 文件大小： | 269K |
| 代理商： | HCPL-J454 |
7
Insulation and Safety Related Specifications
Value
Parameter
Symbol
Units
Conditions
HCPL-4504
7.1
HCPL-J454
7.4
HCPL-0454
4.9
HCNW4504
9.6
Minimum External
Air Gap (External
Clearance)
L(101)
mm
Measured from input
terminals to output
terminals, shortest
distance through air.
Measured from input
terminals to output
terminals, shortest
distance path along
body.
Through insulation
distance, conductor
to conductor,
usually the direct
distance between the
photoemitter and
photodetector inside
the optocoupler
cavity.
Measured from input
terminals to output
terminals, along
internal cavity.
Volts DIN IEC 112/VDE
0303 Part 1
Minimum External
Tracking (External
Creepage)
L(102)
7.4
8.0
4.8
10.0
mm
Minimum Internal
Plastic Gap
(Internal Clearance)
0.08
0.5
0.08
1.0
mm
Minimum Internal
Tracking (Internal
Creepage)
NA
NA
NA
4.0
mm
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
CTI
≥
175
≥
175
≥
175
≥
200
IIIa
IIIa
IIIa
IIIa
Material Group
(DIN VDE 0110,
1/89, Table 1)
All Agilent data sheets report the
creepage and clearance inherent
to the optocoupler component
itself. These dimensions are
needed as a starting point for the
equipment designer when
determining the circuit insulation
requirements.
However, once mounted on a
printed circuit board, minimum
creepage and clearance
requirements must be met as
specified for individual
equipment standards. For
creepage, the shortest distance
path along the surface of a
printed circuit board between the
solder fillets of the input and
output leads must be considered.
There are recommended
techniques such as grooves and
ribs which may be used on a
printed circuit board to achieve
desired creepage and clearances.
Creepage and clearance distances
will also change depending on
factors such as pollution degree
and insulation level.
相關PDF資料 |
PDF描述 |
|---|---|
| HCPL-0454 | High CMR, High Speed Optocouplers(高CMR，高速光耦合器) |
| HCPL-J456 | Intelligent Power Module and Gate Drive Interface Optocouplers(智能功率模塊和門驅(qū)動接口光耦合器) |
| HCPL-0466 | Intelligent Power Module and Gate Drive Interface Optocouplers(智能功率模塊和門驅(qū)動接口光耦合器) |
| HCPL-M454 | Ultra High CMR, Small Outline,5 Lead, High Speed Optocoupler(超高CMR，小型，5引線，高速光耦合器) |
| HCPL-M700 | Small Outline, 5 Lead, Low Input Current, High Gain Optocouplers(小型，5引線，低輸入電流，高增益光耦合器) |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| HCPL-J454#300 | 功能描述:高速光耦合器 1MBd 1Ch 12mA RoHS:否 制造商:Avago Technologies 電流傳遞比: 最大波特率: 最大正向二極管電壓:1.75 V 最大反向二極管電壓:5 V 最大功率耗散:40 mW 最大工作溫度:+125 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-5 封裝:Tube |
| HCPL-J454#500 | 功能描述:高速光耦合器 1MBd 1Ch 12mA RoHS:否 制造商:Avago Technologies 電流傳遞比: 最大波特率: 最大正向二極管電壓:1.75 V 最大反向二極管電壓:5 V 最大功率耗散:40 mW 最大工作溫度:+125 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-5 封裝:Tube |
| HCPL-J454-000E | 功能描述:高速光耦合器 1MBd 1Ch 12mA RoHS:否 制造商:Avago Technologies 電流傳遞比: 最大波特率: 最大正向二極管電壓:1.75 V 最大反向二極管電壓:5 V 最大功率耗散:40 mW 最大工作溫度:+125 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-5 封裝:Tube |
| HCPL-J454-300E | 功能描述:高速光耦合器 1MBd 1Ch 12mA RoHS:否 制造商:Avago Technologies 電流傳遞比: 最大波特率: 最大正向二極管電壓:1.75 V 最大反向二極管電壓:5 V 最大功率耗散:40 mW 最大工作溫度:+125 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-5 封裝:Tube |
| HCPL-J454-400E | 功能描述:高速光耦合器 1MBd 1Ch 12mA RoHS:否 制造商:Avago Technologies 電流傳遞比: 最大波特率: 最大正向二極管電壓:1.75 V 最大反向二極管電壓:5 V 最大功率耗散:40 mW 最大工作溫度:+125 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-5 封裝:Tube |
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