參數(shù)資料
型號: HCPL-810J
英文描述: PLC Powerline DAA IC
中文描述: 集成電路的PLC電力線DAA
文件頁數(shù): 4/16頁
文件大小: 307K
代理商: HCPL-810J
4
Package Characteristics
All specifications and figures are at the nominal (typical) operating conditions of V
CC1
= 5 V, GND1 = 0 V, V
CC2
= 5 V, GND2 =
0 V and T
A
= +25
°
C.
Notes:
1. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage
4500 Vrms for 1 second (leakage detection current
limit, I
I-O
5
μ
A). This test is performed before the 100% production test for partial discharge (method b) shown in IEC/EN/DIN EN 60747-5-2 Insulation
Characteristics Table, if applicable.
2. The Control IC-Line IC Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as a Control IC-Line IC continuous
voltage rating. For the continuous voltage rating refer to your equipment level safety specification or IEC/EN/DIN EN 60747-5-2 Insulation
Characteristics Table.
3. Device is considered as a two terminal device: pins 1 - 8 shorted together and pins 9 - 16 shorted together.
4. Maximum power dissipation in Control side and Line side IC's needs to be limited to ensure that their respective junction temperature is less than 125
°
C.
The maximum permissible power dissipation is dependent on the thermal impedance and the ambient temperature. Details on the typical thermal
impedances are given in the Package Characteristics. Further details on applying this to an actual application can be found in the Application Information
section under Thermal Considerations.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3C + 1C/–0.5C/SEC.
REFLOW HEATING RATE 2.5C ± 0.5C/SEC.
Parameter
Control IC
Line IC Momentary
Withstand Voltage
Resistance (Control IC
Line IC)
Capacitance (Control IC – Line IC)
Control IC to Ambient Thermal Resistance
θ
IA
Line IC to Ambient Thermal Resistance
Symbol
V
ISO
Min.
3750
Typ.
Max.
Units
V
rms
Test Conditions
RH< 50%, t = 1 min.,
T
A
= 25
°
C
V
I-O
= 500 V
dc
f = 1 MHz
Note
1, 2, 3
R
I-O
C
I-O
>10
9
pF
°
C/W
3
1.4
83
1 oz. trace, 2-layer
PCB, Still air, T
A
= 25
°
C
4
θ
OA
85
0
TIME (SECONDS)
T
200
100
50
150
100
200
250
0
30
SEC.
50 SEC.
30
SEC.
160C
150C
140C
PEAK
TEMP.
245C
PEAK
TEMP.
240C
PEAK
TEMP.
230C
SOLDERING
TIME
200C
PREHEATING TIME
150C, 90 + 30 SEC.
2.5C ± 0.5C/SEC.
3C + 1C/–0.5C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
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