Absolute Maximum Ratings TA = 25°C
參數(shù)資料
型號: HC55150CMZ
廠商: Intersil
文件頁數(shù): 31/36頁
文件大小: 0K
描述: IC SLIC UNIVERSAL LP 28-PLCC
標準包裝: 925
系列: UniSLIC14
功能: 用戶線路接口概念(SLIC)
電路數(shù): 1
電源電壓: 4.75 V ~ 5.25 V
電流 - 電源: 2.25mA
功率(瓦特): 2W
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 28-LCC(J 形引線)
供應商設備封裝: 28-PLCC(11.51x11.51)
包裝: 管件
包括: 電池跟蹤抗削頂失真,回路和接地鍵檢測,振鈴控制
4
FN4659.13
June 1, 2006
Absolute Maximum Ratings TA = 25°C
Thermal Information
Temperature, Humidity
Storage Temperature Range . . . . . . . . . . . . . . . . .-65°C to 150°C
Operating Temperature Range. . . . . . . . . . . . . . . . -40°C to 110°C
Operating Junction Temperature Range . . . . . . . .-40°C to 150°C
Power Supply (-40°C
≤ T
A ≤ 85°C)
Supply Voltage VCC to GND . . . . . . . . . . . . . . . . . . . . -0.4V to 7V
Supply Voltage VBL to GND . . . . . . . . . . . . . . . . . . . .-VBH to 0.4V
Supply Voltage VBH to GND, Continuous . . . . . . . . . -75V to 0.4V
Supply Voltage VBH to GND, 10ms . . . . . . . . . . . . . . -80V to 0.4V
Relay Driver
Ring Relay Supply Voltage . . . . . . . . . . . . . . . . . . . . . . 0V to 14V
Ring Relay Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Digital Inputs, Outputs (C1, C2, C3, C4, C5, SHD, GKD_LVM)
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to VCC
Output Voltage (SHD, GKD_LVM Not Active) . . . . . -0.4V to VCC
Output Current (SHD, GKD_LVM) . . . . . . . . . . . . . . . . . . . . . 5mA
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500V
Gate Count. . . . . . . . . . . . . . . . . . . . . . . 543 Transistors, 51 Diodes
Tipx and Ringx Terminals (-40°C
≤ TA ≤ 85°C)
Tipx or Ringx Current . . . . . . . . . . . . . . . . . . . . -100mA to 100mA
Thermal Resistance (Typical, Note 1)
θJA
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . .
52°C/W
28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . .
45°C/W
32 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . .
66.2°C/W
Continuous Power Dissipation at 85°C
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5W
28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0W
32 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4W
Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . . . . . 300°C
(PLCC, SOIC - Lead Tips Only)
Derate above 70°C
Tip and Ring Terminals
Tipx or Ringx, Current, Pulse < 10ms, TREP > 10s . . . . . . . . . .2A
Tipx or Ringx, Current, Pulse < 1ms, TREP > 10s . . . . . . . . . . .5A
Tipx or Ringx, Current, Pulse < 10
s, T
REP > 10s . . . . . . . . . 15A
Tipx or Ringx, Current, Pulse < 1
s, TREP > 10s . . . . . . . . . .20A
Tipx or Ringx, Pulse < 250ns, TREP > 10s
20A
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA is measured with the component mounted on an evaluation PC board in free air.
Typical Operating Conditions
These represent the conditions under which the device was developed and are suggested as guidelines.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Ambient Temperature
HC55120, HC55150/1
0
-
70
°C
HC55121, HC55130/1, HC55140/1,
HC55142/3
-40
-
85
°C
VBH with Respect to GND
-58
-
-8
V
VBL with Respect to GND
VBH
-0
V
VCC with Respect to GND
4.75
-
5.25
V
HC55120, HC55121, HC55130, HC55140, HC55142, HC55143, HC55150
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