參數(shù)資料
型號: HC55142IMZ96
廠商: INTERSIL CORP
元件分類: 模擬傳輸電路
英文描述: Low Power Universal SLIC Family
中文描述: TELECOM-SLIC, PQCC28
封裝: ROHS COMPLIANT, PLASTIC, LCC-28
文件頁數(shù): 36/36頁
文件大?。?/td> 701K
代理商: HC55142IMZ96
36
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN4659.13
June 1, 2006
HC55120, HC55121, HC55130, HC55140, HC55142, HC55143, HC55150
Plastic Leaded Chip Carrier Packages (PLCC)
A1
A
SEATING
PLANE
0.015 (0.38)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
PIN (1)
IDENTIFIER
C
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.050 (1.27)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
C
NE
ND
(0.12)
0.005
M
D S
- B S
A S
0.042 (1.07)
0.048 (1.22)
N32.45x55
(JEDEC MS-016AE ISSUE A)
32 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.125
0.140
3.18
3.55
-
A1
0.060
0.095
1.53
2.41
-
D
0.485
0.495
12.32
12.57
-
D1
0.447
0.453
11.36
11.50
3
D2
0.188
0.223
4.78
5.66
4, 5
E
0.585
0.595
14.86
15.11
-
E1
0.547
0.553
13.90
14.04
3
E2
0.238
0.273
6.05
6.93
4, 5
N
28
28
6
ND
7
7
7
NE
9
9
7
Rev. 0 7/98
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimen-
sions are not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Al-
lowable mold protrusion is 0.010 inch (0.25mm) per side.
Dimensions D1 and E1 include mold mismatch and are mea-
sured at the extreme material condition at the body parting
line.
4. To be measured at seating plane
5. Centerline to be determined where center leads exit plastic
body.
6. “N” is the number of terminal positions.
7. ND denotes the number of leads on the two shorts sides of the
package, one of which contains pin #1. NE denotes the num-
ber of leads on the two long sides of the package.
contact point.
-C-
相關(guān)PDF資料
PDF描述
HC55121 Ultra Low Power SLICs.(超低功耗用戶線路接口電路)
HC55130 Ultra Low Power SLICs.(超低功耗用戶線路接口電路)
HC5515CMZ ITU CO/PABX SLIC with Low Power Standby
HC5515 ITU CO/PABX SLIC with Low Power Standby
HC5515CM ITU CO/PABX SLIC with Low Power Standby
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HC55143 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Low Power Universal SLIC Family
HC55143IM 功能描述:IC SLIC UNIVERSAL LP 32-PLCC RoHS:否 類別:集成電路 (IC) >> 接口 - 電信 系列:UniSLIC14 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS 產(chǎn)品變化通告:Product Discontinuation 06/Feb/2012 標準包裝:750 系列:*
HC5514X 制造商:Harris Corporation 功能描述:
HC5514XB 制造商:Harris Corporation 功能描述:
HC5514XEVAL1 功能描述:界面開發(fā)工具 UNISLIC14 FAMILY EVALUATION BRD RoHS:否 制造商:Bourns 產(chǎn)品:Evaluation Boards 類型:RS-485 工具用于評估:ADM3485E 接口類型:RS-485 工作電源電壓:3.3 V