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參數(shù)資料
| 型號(hào)： | HBD437D |
| 廠商： | HSMC CORP. |
| 英文描述： | COMPLEMENTARY SILICON POWER TRANSISTORS |
| 中文描述： | 互補(bǔ)性的芯片功率晶體管 |
| 文件頁(yè)數(shù)： | 3/4頁(yè) |
| 文件大小： | 56K |
| 代理商： | HBD437D |
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HD200201
Issued Date : 2001.04.01
Revised Date : 2005.08.16
Page No. : 3/4
HBD437D
HSMC Product Specification
TO-126ML Dimension
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
D
I
E
B
G
F
A
N
C
H
3
2
1
M
J
K
L
3-Lead TO-126ML
Plastic Package
HSMC Package Code: D
Marking:
Control Code
Date Code
H
4 3 7
D
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
Note: Green
label is used for pb-free packing
Pin Style: 1.Emitter 2.Collector 3.Base
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
Min.
7.74
10.87
0.88
1.28
3.50
2.61
13
1.18
2.88
0.68
-
3.44
1.88
0.50
Max.
8.24
11.37
1.12
1.52
3.75
3.37
-
1.42
3.12
0.84
2.30
3.70
2.14
0.51
*: Typical, Unit: mm
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