參數(shù)資料
型號: GS8662S09E-200I
廠商: GSI TECHNOLOGY
元件分類: DRAM
英文描述: 72Mb Burst of 2 DDR SigmaSIO-II SRAM
中文描述: 8M X 9 DDR SRAM, 0.45 ns, PBGA165
封裝: 15 X 17 MM, 1 MM PITCH, MO-216CAB-1, FPBGA-165
文件頁數(shù): 3/37頁
文件大小: 960K
代理商: GS8662S09E-200I
8M x 9 SigmaQuad SRAM—Top View
1
2
3
4
5
6
7
8
9
10
11
A
CQ
SA
SA
R/W
NC
K
NC
LD
SA
SA
CQ
B
NC
NC
NC
SA
NC
K
BW
SA
NC
NC
Q4
C
NC
NC
NC
V
SS
SA
SA
SA
V
SS
NC
NC
D4
D
NC
D5
NC
V
SS
V
SS
V
SS
V
SS
V
SS
NC
NC
NC
E
NC
NC
Q5
V
DDQ
V
SS
V
SS
V
SS
V
DDQ
NC
D3
Q3
F
NC
NC
NC
V
DDQ
V
DD
V
SS
V
DD
V
DDQ
NC
NC
NC
G
NC
D6
Q6
V
DDQ
V
DD
V
SS
V
DD
V
DDQ
NC
NC
NC
H
Doff
V
REF
V
DDQ
V
DDQ
V
DD
V
SS
V
DD
V
DDQ
V
DDQ
V
REF
ZQ
J
NC
NC
NC
V
DDQ
V
DD
V
SS
V
DD
V
DDQ
NC
Q2
D2
K
NC
NC
NC
V
DDQ
V
DD
V
SS
V
DD
V
DDQ
NC
NC
NC
L
NC
Q7
D7
V
DDQ
V
SS
V
SS
V
SS
V
DDQ
NC
NC
Q1
M
NC
NC
NC
V
SS
V
SS
V
SS
V
SS
V
SS
NC
NC
D1
N
NC
D8
NC
V
SS
SA
SA
SA
V
SS
NC
NC
NC
P
NC
NC
Q8
SA
SA
C
SA
SA
NC
D0
NC
R
TDO
TCK
SA
SA
SA
C
SA
SA
SA
TMS
TDI
11 x 15 Bump BGA—15 x 17 mm
2
Body—1 mm Bump Pitch
Notes:
1.
1.
BW controls writes to D0:D7
It is recommended that H1 be tied low for compatibility with future devices.
Preliminary
GS8662S08/09/18/36E-333/300/250/200/167
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.01 9/2005
3/37
2005, GSI Technology
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GS8662S09E-250 72Mb Burst of 2 DDR SigmaSIO-II SRAM
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