參數(shù)資料
型號： GS816218BD-200
廠商： GSI TECHNOLOGY
元件分類： DRAM
英文描述： 1M x 18, 512K x 36 18MbS/DCD Sync Burst SRAMs
中文描述： 1M X 18 CACHE SRAM, 6.5 ns, PBGA165
封裝： FBGA-165
文件頁數(shù)： 36/37頁
文件大?。?/td> 866K
代理商： GS816218BD-200
GS816218/36B(B/D)
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.04 9/2005
36/37
2004, GSI Technology
512K x 36
GS816236BGD-250
Pipeline/Flow Through
RoHS-compliant 165 BGA
250/5.5
C
PQ
512K x 36
GS816236BGD-200
Pipeline/Flow Through
RoHS-compliant 165 BGA
200/6.5
C
PQ
512K x 36
GS816236BGD-150
Pipeline/Flow Through
RoHS-compliant 165 BGA
150/7.5
C
PQ
1M x 18
GS816218BGD-250I
Pipeline/Flow Through
RoHS-compliant 165 BGA
250/5.5
I
PQ
1M x 18
GS816218BGD-200I
Pipeline/Flow Through
RoHS-compliant 165 BGA
200/6.5
I
PQ
1M x 18
GS816218BGD-150I
Pipeline/Flow Through
RoHS-compliant 165 BGA
150/7.5
I
PQ
512K x 36
GS816236BGD-250I
Pipeline/Flow Through
RoHS-compliant 165 BGA
250/5.5
I
PQ
512K x 36
GS816236BGD-200I
Pipeline/Flow Through
RoHS-compliant 165 BGA
200/6.5
I
PQ
512K x 36
GS816236BGD-150I
Pipeline/Flow Through
RoHS-compliant 165 BGA
150/7.5
I
PQ
512K x 36
GS816236BGD-250
Pipeline/Flow Through
RoHS-compliant 165 BGA
250/5.5
C
PQ
512K x 36
GS816236BGD-200
Pipeline/Flow Through
RoHS-compliant 165 BGA
200/6.5
C
PQ
512K x 36
GS816236BGD-150
Pipeline/Flow Through
RoHS-compliant 165 BGA
150/7.5
C
PQ
1M x 18
GS816218BGD-250I
Pipeline/Flow Through
RoHS-compliant 165 BGA
250/5.5
I
PQ
1M x 18
GS816218BGD-200I
Pipeline/Flow Through
RoHS-compliant 165 BGA
200/6.5
I
PQ
1M x 18
GS816218BGD-150I
Pipeline/Flow Through
RoHS-compliant 165 BGA
150/7.5
I
PQ
512K x 36
GS816236BGD-250I
Pipeline/Flow Through
RoHS-compliant 165 BGA
250/5.5
I
PQ
512K x 36
GS816236BGD-200I
Pipeline/Flow Through
RoHS-compliant 165 BGA
200/6.5
I
PQ
512K x 36
GS816236BGD-150I
Pipeline/Flow Through
RoHS-compliant 165 BGA
150/7.5
I
PQ
Ordering Information for GSI Synchronous Burst RAMs
(Continued)
Org
Part Number
1
Type
Package
Speed
2
(MHz/ns)
T
A3
Status
Notes:
1.
2.
Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS816236BD-200IT.
The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
T
A
= C = Commercial Temperature Range. T
A
= I = Industrial Temperature Range.
MP = Mass Production. PQ = Pre-Qualification.
GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings
3.
4.
5.
相關(guān)PDF資料
PDF描述
GS816218BD-200I 1M x 18, 512K x 36 18MbS/DCD Sync Burst SRAMs
GS816218BD-250 1M x 18, 512K x 36 18MbS/DCD Sync Burst SRAMs
GS816218BD-250I 1M x 18, 512K x 36 18MbS/DCD Sync Burst SRAMs
GS816218BGB-150 1M x 18, 512K x 36 18MbS/DCD Sync Burst SRAMs
GS816218BGB-150I 1M x 18, 512K x 36 18MbS/DCD Sync Burst SRAMs
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GS816218BD-200I 制造商:GSI Technology 功能描述:SRAM SYNC SGL 2.5V/3.3V 18MBIT 1MX18 6.5NS/3NS 165FBGA - Trays
GS816218BD-200IV 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 2.5V/3.3V 18MBIT 1MX18 6.5NS/3NS 165FPBGA - Trays
GS816218BD-200M 制造商:GSI Technology 功能描述:165 BGA - Bulk
GS816218BD-200V 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 2.5V/3.3V 18MBIT 1MX18 6.5NS/3NS 165FPBGA - Trays
GS816218BD-225I 制造商:GSI Technology 功能描述:1M X 18 (18 MEG) SYNCH BURST , SCD, JTAG, FLEXDRIVE - Trays
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