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| 型號(hào)： | GS816136D-225 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Straight Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
| 中文描述： | 165焊球BGA封裝？x18 Commom的I / O？頂視圖（D組） |
| 文件頁(yè)數(shù)： | 16/40頁(yè) |
| 文件大?。?/td> | 1391K |
| 代理商： | GS816136D-225 |
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Rev: 2.12 9/2002
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
8/32
1999, Giga Semiconductor, Inc.
GS816118/36T-250/225/200/166/150/133
Synchronous Truth Table
Operation
Address Used
State
Diagram
Key
5
X
R
R
W
CR
CR
CW
CW
E
1
ADSP
ADSC
ADV
W
3
DQ
4
Deselect Cycle, Power Down
Read Cycle, Begin Burst
Read Cycle, Begin Burst
Write Cycle, Begin Burst
Read Cycle, Continue Burst
Read Cycle, Continue Burst
Write Cycle, Continue Burst
Write Cycle, Continue Burst
Read Cycle, Suspend Burst
Read Cycle, Suspend Burst
Write Cycle, Suspend Burst
Write Cycle, Suspend Burst
Notes:
1.
X = Don’t Care, H = High, L = Low
2.
W = T (True) and F (False) is defined in the Byte Write Truth Table preceding.
3.
G is an asynchronous input. G can be driven high at any time to disable active output drivers. G low can only enable active drivers (shown
as “Q” in the Truth Table above).
4.
All input combinations shown above are tested and supported. Input combinations shown in gray boxes need not be used to accomplish
basic synchronous or synchronous burst operations and may be avoided for simplicity.
5.
Tying ADSP high and ADSC low allows simple non-burst synchronous operations. See
BOLD
items above.
6.
Tying ADSP high and ADV low while using ADSC to load new addresses allows simple burst operations. See
ITALIC
items above.
None
External
External
External
Next
Next
Next
Next
Current
Current
Current
Current
H
L
L
L
X
H
X
H
X
H
X
H
X
L
H
H
H
X
H
X
H
X
H
X
L
X
L
L
H
H
H
H
H
H
H
H
X
X
X
X
L
L
L
L
H
H
H
H
X
X
F
T
F
F
T
T
F
F
T
T
High-Z
Q
Q
D
Q
Q
D
D
Q
Q
D
D
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| GS816136D-225I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-250 | Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Mounting Type:PCB Straight Thru Hole; Terminal Type:Solder Tail; Pin Length:0.318" RoHS Compliant: Yes |
| GS816136D-250I | .1" PIN STRIP HEADER |
| GS816136T-166I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136 | 16Mb Pipelined and Flow Through Synchronous NBT SRAM(16M位流水線式和流通型同步NBT靜態(tài)RAM) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GS816136D-225I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-250 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-250I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136DD-150 | 制造商:GSI Technology 功能描述:165 BGA - Bulk |
| GS816136DD-150I | 制造商:GSI Technology 功能描述:165 BGA - Bulk |
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