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參數(shù)資料
| 型號： | GS816136D-150I |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| 中文描述： | 165焊球BGA封裝？x18 Commom的I / O？頂視圖（D組） |
| 文件頁數(shù)： | 9/40頁 |
| 文件大小： | 1391K |
| 代理商： | GS816136D-150I |
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Rev: 2.12 9/2002
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
1/32
1999, Giga Semiconductor, Inc.
GS816118/36T-250/225/200/166/150/133
1M x 18, 512K x 36
18Mb Sync Burst SRAMs
250 MHz
–
133 MHz
2.5 V or 3.3 V V
DD
2.5 V or 3.3 V I/O
100-Pin TQFP
Commercial Temp
Industrial Temp
Features
IEEE 1149.1 JTAG-compatible Boundary Scan
2.5 V or 3.3 V +10%/–10% core power supply
2.5 V or 3.3 V I/O supply
LBO pin for Linear or Interleaved Burst mode
Internal input resistors on mode pins allow floating mode pins
Byte Write (BW) and/or Global Write (GW) operation
Internal self-timed write cycle
Automatic power-down for portable applications
JEDEC-standard package
-250 -225 -200 -166 -150 -133 Unit
Pipeline
3-1-1-1
tCycle
4.0
4.4
Curr (x18)
Curr (x36)
330
300
Curr (x18)
Curr (x36)
320
295
Flow
Through
2-1-1-1
Curr (x18)
Curr (x36)
200
190
Curr (x18)
Curr (x36)
200
190
Functional Description
Applications
The GS816118/36T is an 18,874,368-bit high performance
synchronous SRAM with a 2-bit burst address counter.
Although of a type originally developed for Level 2 Cache
applications supporting high performance CPUs, the device
now finds application in synchronous SRAM applications,
ranging from DSP main store to networking chip set support.
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV) and write control inputs (Bx, BW,
GW) are synchronous and are controlled by a positive-edge-
triggered clock input (CK). Output enable (G) and power down
control (ZZ) are asynchronous inputs. Burst cycles can be
initiated with either ADSP or ADSC inputs. In Burst mode,
subsequent burst addresses are generated internally and are
controlled by ADV. The burst address counter may be
configured to count in either linear or interleave order with the
Linear Burst Order (LBO) input. The Burst function need not
be used. New addresses can be loaded on every cycle with no
degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by
the user via the FT mode pin (Pin 14). Holding the FT mode pin
low places the RAM in Flow Through mode, causing output
data to bypass the Data Output Register. Holding FT high
places the RAM in Pipeline mode, activating the rising-edge-
triggered Data Output Register.
SCD Pipelined Reads
The GS816118/36T is a SCD (Single Cycle Deselect)
pipelined synchronous SRAM. DCD (Dual Cycle Deselect)
versions are also available. SCD SRAMs pipeline deselect
commands one stage less than read commands. SCD RAMs
begin turning off their outputs immediately after the deselect
command has been captured in the input registers.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Core and Interface Voltages
The GS816118/36T operates on a 2.5 V or 3.3 V power supply.
All input are 3.3 V and 2.5 V compatible. Separate output
power (V
DDQ
) pins are used to decouple output noise from the
internal circuits and are 3.3 V and 2.5 V compatible.
t
KQ
2.5
2.7
3.0
5.0
230
270
230
265
3.4
6.0
200
230
195
225
3.8
6.7
185
215
180
210
4.0
7.5
165
190
165
185
ns
ns
mA
mA
mA
mA
3.3 V
280
255
2.5 V
275
250
t
KQ
tCycle
5.5
5.5
6.0
6.0
6.5
6.5
7.0
7.0
7.5
7.5
8.5
8.5
ns
ns
3.3 V
175
165
160
180
160
180
150
170
150
170
145
165
145
165
135
150
135
150
mA
mA
mA
mA
2.5 V
175
165
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| GS816136D-166 | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-166I | 2 ROW 4PIN 30U GOLD |
| GS816136D-200 | 2 ROW, 4PIN, 30 U GOLD |
| GS816136D-200I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-225 | Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Straight Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GS816136D-166 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-166I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-200 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-200I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-225 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
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