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參數(shù)資料
| 型號： | GS816136D-150I |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| 中文描述： | 165焊球BGA封裝？x18 Commom的I / O？頂視圖（D組） |
| 文件頁數(shù)： | 8/40頁 |
| 文件大小： | 1391K |
| 代理商： | GS816136D-150I |
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8/8
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Revision: 9/26/02
GS816118/32/36D
Supplemental Datasheet Information
512K x 32
512K x 32
512K x 32
512K x 32
512K x 36
512K x 36
512K x 36
512K x 36
512K x 36
512K x 36
Notes:
1.
Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS816136AD-100IT.
2.
The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3.
T
A
= C = Commercial Temperature Range. T
A
= I = Industrial Temperature Range.
4.
GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which
are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings
GS816132D-200I
GS816132D-166I
GS816132D-150I
GS816132D-133I
GS816136D-250I
GS816136D-225I
GS816136D-200I
GS816136D-166I
GS816136D-150I
GS816136D-133I
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
200/6.5
166/7
150/7.5
133/8.5
250/5.5
225/6
200/6.5
166/7
150/7.5
133/8.5
I
I
I
I
I
I
I
I
I
I
Ordering Information
Org
Part Number
1
Type
Package
Speed
2
(MHz/ns)
T
A3
Status
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| GS816136D-166 | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-166I | 2 ROW 4PIN 30U GOLD |
| GS816136D-200 | 2 ROW, 4PIN, 30 U GOLD |
| GS816136D-200I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-225 | Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Straight Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GS816136D-166 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-166I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-200 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-200I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-225 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
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