參數(shù)資料
型號: GS816136D-133
廠商: Electronic Theatre Controls, Inc.
英文描述: 165 Bump BGA?x18 Commom I/O?Top View (Package D)
中文描述: 165焊球BGA封裝?x18 Commom的I / O?頂視圖(D組)
文件頁數(shù): 37/40頁
文件大?。?/td> 1391K
代理商: GS816136D-133
Rev: 2.12 9/2002
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
29/32
1999, Giga Semiconductor, Inc.
GS816118/36T-250/225/200/166/150/133
TQFP Package Drawing
D
D
E1
E
P
b
e
c
L
L1
A2
A1
Y
θ
Notes:
1.
2.
All dimensions are in millimeters (mm).
Package width and length do not include mold protrusion.
Symbol
Description
Min.
Nom.
Max
A1
Standoff
0.05
0.10
0.15
A2
Body Thickness
1.35
1.40
1.45
b
Lead Width
0.20
0.30
0.40
c
Lead Thickness
0.09
0.20
D
Terminal Dimension
21.9
22.0
22.1
D1
Package Body
19.9
20.0
20.1
E
Terminal Dimension
15.9
16.0
16.1
E1
Package Body
13.9
14.0
14.1
e
Lead Pitch
0.65
L
Foot Length
0.45
0.60
0.75
L1
Lead Length
1.00
Y
Coplanarity
0.10
θ
Lead Angle
0
°
7
°
相關PDF資料
PDF描述
GS816136D-133I PCB Header; No. of Contacts:72; Pitch Spacing:0.1"; No. of Rows:2; Series:929; Body Material:Glass-Filled Polyester; Contact Material:Copper Alloy; Contact Plating:Tin-Lead Over Nickel; Mounting Type:PCB Straight Thru Hole RoHS Compliant: Yes
GS816136D-150 PCB Header; No. of Contacts:72; Pitch Spacing:0.1"; No. of Rows:2; Series:929; Body Material:Glass-Filled Polyester; Contact Material:Copper Alloy; Contact Plating:Tin; Leaded Process Compatible:Yes RoHS Compliant: Yes
GS816136D-150I 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-166 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-166I 2 ROW 4PIN 30U GOLD
相關代理商/技術參數(shù)
參數(shù)描述
GS816136D-133I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-150 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-150I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-166 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-166I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)