參數(shù)資料
型號: GS816136D-133
廠商: Electronic Theatre Controls, Inc.
英文描述: 165 Bump BGA?x18 Commom I/O?Top View (Package D)
中文描述: 165焊球BGA封裝?x18 Commom的I / O?頂視圖(D組)
文件頁數(shù): 36/40頁
文件大小: 1391K
代理商: GS816136D-133
相關(guān)PDF資料
PDF描述
GS816136D-133I PCB Header; No. of Contacts:72; Pitch Spacing:0.1"; No. of Rows:2; Series:929; Body Material:Glass-Filled Polyester; Contact Material:Copper Alloy; Contact Plating:Tin-Lead Over Nickel; Mounting Type:PCB Straight Thru Hole RoHS Compliant: Yes
GS816136D-150 PCB Header; No. of Contacts:72; Pitch Spacing:0.1"; No. of Rows:2; Series:929; Body Material:Glass-Filled Polyester; Contact Material:Copper Alloy; Contact Plating:Tin; Leaded Process Compatible:Yes RoHS Compliant: Yes
GS816136D-150I 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-166 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-166I 2 ROW 4PIN 30U GOLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GS816136D-133I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-150 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-150I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-166 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-166I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)