- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄383022 > GS816118D-225I (Electronic Theatre Controls, Inc.) 165 Bump BGA?x18 Commom I/O?Top View (Package D) PDF資料下載
參數(shù)資料
| 型號(hào)： | GS816118D-225I |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| 中文描述： | 165焊球BGA封裝？x18 Commom的I / O？頂視圖（D組） |
| 文件頁(yè)數(shù)： | 17/40頁(yè) |
| 文件大小： | 1391K |
| 代理商： | GS816118D-225I |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)當(dāng)前第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)
Rev: 2.12 9/2002
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
9/32
1999, Giga Semiconductor, Inc.
GS816118/36T-250/225/200/166/150/133
Simplified State Diagram
First Write
First Read
Burst Write
Burst Read
Deselect
R
W
CR
CW
X
X
W
R
R
W
R
X
X
X
S
S
CR
R
CW
CR
CR
Notes:
1.
2.
The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low.
The upper portion of the diagram assumes active use of only the Enable (E1) and Write (B
A
, B
B
, B
C
, B
D
, BW, and GW) control inputs, and
that ADSP is tied high and ADSC is tied low.
The upper and lower portions of the diagram together assume active use of only the Enable, Write, and ADSC control inputs, and
assumes ADSP is tied high and ADV is tied low.
3.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| GS816118D-250 | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-250I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816132D-133 | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816132D-133I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816132D-150 | Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Right Angle Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GS816118D-250 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-250I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118DD-150 | 制造商:GSI Technology 功能描述:165 BGA - Bulk |
| GS816118DD-150I | 制造商:GSI Technology 功能描述:165 BGA - Bulk |
| GS816118DD-150IV | 制造商:GSI Technology 功能描述:165 BGA - Bulk |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。